Abstract: A process for electrochemical deposition of copper, including: providing a rolled and annealed copper foil comprising a first surface and a second surface, etching the first surface of the rolled and annealed copper foil, thereby creating a first etched surface, depositing copper by electroless copper deposition on the first etched surface, thereby creating a first electroless copper layer on the first etched surface, depositing further copper by electrochemical deposition on the first electroless copper layer, thereby creating a first electrochemical copper layer, wherein in the electrochemical deposition in a first period of time a first current density is applied and in a second period of time a second current density is applied, wherein the second current density is lower than the first current density, and a layered product obtainable by the process.

Abstract: The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Abstract: The invention relates to a method for automatically and dynamically assigning the responsibility for tasks to the available computing components in a highly distributed data-processing system. The invention relates to a method by means of which the assignment of the responsibility for certain tasks (partitions) is adapted in a highly distributed data-processing system.

Abstract: The invention relates to a method for automatically and dynamically assigning the responsibility for tasks to the available computing components in a highly distributed data-processing system. The invention relates to a method by means of which the assignment of the responsibility for certain tasks (partitions) is adapted in a highly distributed data-processing system.

Abstract: The present invention relates to a process for joining workpieces made of zinc-containing aluminum alloys by laser beam welding, in which process a layer consisting of vanadium is introduced into the joining gap between the workpieces to be connected to avoid the formation of pores, and the workpieces are then connected to one another by laser beam welding.