Patents by Inventor Peter Haberl

Peter Haberl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for checking an object for flaws
    Patent number: 11067540
    Abstract: The invention relates, in a first aspect, to a method for inspecting an object, in particular a pipeline, for flaws, comprising: emitting a first signal toward the object in a first direction by means of a first ultrasonic transducer; and receiving a first response signal coming from the object from a second direction by means of a second ultrasonic transducer, wherein the first direction and the second direction are different from each other.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: July 20, 2021
    Assignee: NDT Global Corporate Ltd. Ireland
    Inventors: Michael Werle, Thomas Hennig, Peter Haberl
  • METHOD AND DEVICE FOR CHECKING AN OBJECT FOR FLAWS
    Publication number: 20200300815
    Abstract: The invention relates, in a first aspect, to a method for inspecting an object, in particular a pipeline, for flaws, comprising: emitting a first signal toward the object in a first direction by means of a first ultrasonic transducer; and receiving a first response signal coming from the object from a second direction by means of a second ultrasonic transducer, wherein the first direction and the second direction are different from each other.
    Type: Application
    Filed: November 15, 2017
    Publication date: September 24, 2020
    Inventors: Michael Werle, Thomas Hennig, Peter Haberl
  • Method for producing a metal-ceramic substrate for electric circuits on modules
    Patent number: 8021920
    Abstract: The invention relates to a metal-ceramic substrate for electric circuits or modules, the substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of the ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, the surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: September 20, 2011
    Assignee: Curamik Electronics GmbH
    Inventors: Jürgen Schulz-Harder, Peter Haberl
  • Method for producing a metal-ceramic substrate for electric circuits on modules
    Publication number: 20100186231
    Abstract: The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
    Type: Application
    Filed: January 6, 2010
    Publication date: July 29, 2010
    Inventors: Jurgen Schulz-Harder, Peter Haberl
  • Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
    Patent number: 7750461
    Abstract: The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: July 6, 2010
    Assignee: Curamix Electronics GmbH
    Inventors: Jürgen Schulz-Harder, Peter Haberl
  • Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
    Publication number: 20060103005
    Abstract: The invention relates to a metal-ceramic substrate for electric circuits or modules, said substrate comprising a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of said ceramic layer in a plane manner. An insulating layer consisting of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, said surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.
    Type: Application
    Filed: April 11, 2003
    Publication date: May 18, 2006
    Inventors: Jurgen Schulz-Harder, Peter Haberl