Abstract: A mobile manufacturing device and a method for producing three-dimensional lattice or mesh structures, wherein the mobile manufacturing device is a mobile device adapted to move along a three-dimensional structure to be produced, in particular while performing both translation and rotation movements in three-dimensional space, and wherein the mobile manufacturing device includes a means for detection of its position relative to the dimensional structure to be produced, so that the mobile manufacturing device is able to produce the three-dimensional structure as an autonomous robot.

Abstract: The invention provides systems, methods and computer program products for delivering audio and video data from a plurality of source terminals, to one or more end point terminals through multiplexed data streams. The invention comprises (i) receiving from a plurality of source terminals, a distinct video signal stream and a distinct audio signal stream, (ii) transmitting to each end point terminal, a multiplexed video signal stream comprising composite video frames, wherein each video frame within a composite video frame is (a) extracted from a distinct video signal stream, and (b) time synchronized with one or more other video frames within said composite video frame, and (iii) transmitting to each end point terminal, a multiplexed audio signal stream comprising a composite audio signal, wherein the composite audio signal comprises a composite of time synchronized audio samples, each extracted from a distinct audio signal stream.

Abstract: Method of fabricating a 3-dimensional structure, mesh formwork element for fabricating a 3-dimensional structure, and method of fabricating the same. The method of fabricating a 3-dimensional structure comprises providing a mesh formwork element such that a cavity bound by at least two opposing portions of the mesh formwork is formed; accumulating a material in the cavity; and allowing the material to harden; wherein apertures in the at least two opposing portions of the mesh formwork element are adapted to the hydro-static pressure of the accumulated material or vice versa such that at least two surfaces of the hardened material substantially take on the respective shapes defined by the two opposing portions of the mesh formwork element.

Abstract: A mobile manufacturing device and a method for producing three-dimensional lattice or mesh structures, wherein the mobile manufacturing device is a mobile device adapted to move along a three-dimensional structure to be produced, in particular while performing both translation and rotation movements in three-dimensional space, and wherein the mobile manufacturing device includes a means for detection of its position relative to the dimensional structure to be produced, so that the mobile manufacturing device is able to produce the three-dimensional structure as an autonomous robot.

Abstract: Method of fabricating a 3-dimensional structure, mesh formwork element for fabricating a 3-dimensional structure, and method of fabricating the same. The method of fabricating a 3-dimensional structure comprises providing a mesh formwork element such that a cavity bound by at least two opposing portions of the mesh formwork is formed; accumulating a material in the cavity; and allowing the material to harden; wherein apertures in the at least two opposing portions of the mesh formwork element are adapted to the hydro-static pressure of the accumulated material or vice versa such that at least two surfaces of the hardened material substantially take on the respective shapes defined by the two opposing portions of the mesh formwork element.

Abstract: Embodiments of the invention contemplate the formation of a solar cell device that has improved efficiency and device electrical properties. In one embodiment, the solar cell device described herein includes an Emitter Wrap Through (EWT) solar cell that has plurality of laser drilled vias disposed in a spaced apart relationship to metal gridlines formed on a surface of the substrate. Solar cell structures that may benefit from the invention disclosed herein include back-contact solar cells, such as those in which both positive and negative contacts are formed only on the rear surface of the device.

Abstract: Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

Abstract: Back contact solar cells including rear surface structures and methods for making same. The rear surface has small contact areas through at least one dielectric layer, including but not limited to a passivation layer, a nitride layer, a diffusion barrier, and/or a metallization barrier. The dielectric layer is preferably screen printed. Large grid areas overlay the dielectric layer. The methods provide for increasing efficiency by minimizing p-type contact areas and maximizing n-type doped regions on the rear surface of a p-type substrate.

Abstract: Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

Abstract: Back contact solar cells including rear surface structures and methods for making same. The rear surface has small contact areas through at least one dielectric layer, including but not limited to a passivation layer, a nitride layer, a diffusion barrier, and/or a metallization barrier. The dielectric layer is preferably screen printed. Large grid areas overlay the dielectric layer. The methods provide for increasing efficiency by minimizing p-type contact areas and maximizing n-type doped regions on the rear surface of a p-type substrate.

Abstract: Methods for manufacturing textured selective emitter back contact solar cells, and solar cells made in accordance therewith. A separate antireflective coating is preferably deposited, which also preferably provides simultaneous hydrogen passivation. The high sheet resistance and low sheet resistance selective emitter diffusions may be performed in either order.

Abstract: Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

Abstract: Method for controlling glass formation on a semiconductor substrate. By using a doped diffusion barrier material, such as a transition metal oxide paste, the subsequent diffusion of glass forming elements into the substrate may be stabilized and controlled.

Abstract: A buried-contact solar cell, in-process buried-contact solar cell components and methods for making buried contact solar cells wherein a self-doping contact material is placed in a plurality of buried-contact surface grooves. By combining groove doping and metallization steps, the resulting solar cell is simpler and more economical to manufacture.

Abstract: Methods for fabrication of emitter wrap through (EWT) back-contact solar cells and cells made by such methods. Certain methods provide for higher concentration of dopant in conductive vias compared to the average dopant concentration on front or rear surfaces, and provided increased efficiency. Certain methods provide for selective doping to holes for forming conductive vias by use of printed dopant pastes. Other methods provide for use of spin-on glass substrates including dopant.

Abstract: Back contact solar cells including rear surface structures and methods for making same. The rear surface is doped to form an n+ emitter and then coated with a dielectric layer. Small regions are scribed in the rear surface and p-type contacts are then formed in the regions. Large conductive grid areas overlay the dielectric layer. The methods provide for increasing efficiency by minimizing p-type contact areas and maximizing n-type doped regions on the rear surface of a p-type substrate.

Abstract: Methods for fabrication of emitter wrap through (EWT) back-contact solar cells and cells made by such methods. Certain methods provide for higher concentration of dopant in conductive vias compared to the average dopant concentration on front or rear surfaces, and provided increased efficiency. Certain methods provide for selective doping to holes for forming conductive vias by use of printed dopant pastes. Other methods provide for use of spin-on glass substrates including dopant.

Abstract: Back contact solar cells including rear surface structures and methods for making same. The rear surface has small contact areas through at least one dielectric layer, including but not limited to a passivation layer, a nitride layer, a diffusion barrier, and/or a metallization barrier. The dielectric layer is preferably screen printed. Large grid areas overlay the dielectric layer. The methods provide for increasing efficiency by minimizing p-type contact areas and maximizing n-type doped regions on the rear surface of a p-type substrate.

Abstract: A buried-contact solar cell, in-process buried-contact solar cell components and methods for making buried contact solar cells wherein a self-doping contact material is placed in a plurality of buried-contact surface grooves. By combining groove doping and metallization steps, the resulting solar cell is simpler and more economical to manufacture.

Abstract: A multiplexing power converter for use with a single inductor for providing multiple power outputs is disclosed. The multiplexing power converter includes first switching means for providing a first low resistance path for current to flow from a power source through an inductor so as to energize the inductor, and at least one second switching means for providing at least one second low resistance path for current to flow from the inductor so as to deenergize the inductor and provide an output current. Only one low resistance current path is provided at any one time.