Abstract: The present invention provides scaffolding erection methods. One method includes considering whether to attach a scaffold frame support to a building frame from inside, and alternatively, outside the building frame wall. Another comprises attaching a load distribution member to distribute transferred load to at least two wall studs. The present invention also provides scaffolding frame members. One is arranged for connection to a top plate from inside, and alternatively, outside a building frame. Another is a load distributor arranged for distribution across at least two studs of the building frame. The present invention also provides kick board and plank joiners.

Abstract: An interface circuit (100) and method for interfacing received digital signals, relative to a first ground potential, for transmission on the bus, relative to a second ground potential. A transformer (106) passes edges of the received digital signals. A Schmitt trigger (110) reconstructs signals from the edges of signals passed by the transformer, so as to produce digital signals, for transmission on the bus, relative to the second ground potential. The Schmitt trigger bias points may be set by an oscillators incorporating another Schmitt triggers (120) located on the same semiconductor die to reduce temperature variability.

Abstract: An interface circuit (100) and method for interfacing digital signals with a bus, comprising: means (TxduC) for receiving digital signals, for transmission on the bus, relative to a first ground potential; transformer means (106) for passing edges of the received digital signals; and reconstruction means (110) for reconstructing signals from the edges of signals passed by the transformer means, so as to produce digital signals, for transmission on the bus, relative to a second ground potential. A similar circuit (CANL, 130, 134) interfaces, from the second ground potential to the first ground potential, signals received from the bus. The reconstruction means may use Schmitt triggers, whose bias points may be set by oscillators incorporating further Schmitt triggers (120, 142) located on the same semiconductor die to reduce temperature variability.