Patents by Inventor Peter Hebert
Peter Hebert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11335822Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.Type: GrantFiled: March 12, 2020Date of Patent: May 17, 2022Assignee: THE BOEING COMPANYInventors: Christopher M. Fetzer, Peter Hebert
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Publication number: 20200388715Abstract: A solar cell design includes fabricating one or more gridlines for extracting photo-current on a front surface of the solar cell, wherein each of the gridlines is a metal grid and a cap layer, and at least a portion of the metal grid is deposited on the cap layer; and controlling an alignment of the metal grid relative to the cap layer, and a width of the cap layer relative to a width of the metal grid, so that a minimum cap edge offset distance value is about 1 ?m or more. The alignment of the metal grid relative to the cap layer and the width of the cap layer relative to the width of the metal grid are controlled at areas on the front surface of the solar cell opposite where welding occurs on a back-side of the solar cell. The alignments and widths of the metal grid relative to the cap layer are controlled by a photomask.Type: ApplicationFiled: June 4, 2019Publication date: December 10, 2020Applicant: The Boeing CompanyInventors: Philip T. Chiu, Peter Hebert, Uming T. Jeng, Christopher M. Fetzer, Moran Haddad, Dennis G. Hom, Joseph P. O'Day
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Publication number: 20200335648Abstract: An interconnect for making electrical connections for a solar cell, wherein the interconnect consists of a single toe, without a second toe connected to the single toe, and with no connected crossbars. A plurality of the interconnects may be placed uniformly across an edge of the solar cell. In one example, three interconnects are placed uniformly across an edge of the solar cell, when the solar cell has an area less than 60 cm2. In another example, four or more interconnects are placed uniformly across an edge of the solar cell, when the solar cell has an area greater than 60 cm2.Type: ApplicationFiled: April 19, 2019Publication date: October 22, 2020Applicant: The Boeing CompanyInventors: Peter Hebert, Philip T. Chiu
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Patent number: 10763376Abstract: A method including forming an interconnect in a metal member. The interconnect includes multiple repeating, nested V-shaped structures forming a continuous central portion. A vertex of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of a next V-shaped structure of the multiple repeating, nested V-shaped structures. The method further includes separating the interconnect from the metal member.Type: GrantFiled: September 2, 2015Date of Patent: September 1, 2020Assignee: THE BOEING COMPANYInventors: John S. Frost, Randolph J. Brandt, Peter Hebert, Omar Al Taher
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Publication number: 20200212239Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.Type: ApplicationFiled: March 12, 2020Publication date: July 2, 2020Applicant: The Boeing CompanyInventors: Christopher M. Fetzer, Peter Hebert
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Patent number: 10593818Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.Type: GrantFiled: December 9, 2016Date of Patent: March 17, 2020Assignee: THE BOEING COMPANYInventors: Christopher M. Fetzer, Peter Hebert
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Publication number: 20190288638Abstract: A rollable solar power module (“RSPM”) is disclosed that includes a flexible substrate, a plurality of adjacent strings of photovoltaic (“PV”) solar cells, and at least one end-tab jumper. The flexible substrate has a flexible substrate length and a top surface that defines. The plurality of adjacent strings are attached on the top surface of the flexible substrate. Each PV solar cell has a perimeter that is a convex polygon. The plurality of adjacent strings are configured to be rollable along the flexible substrate length, where each adjacent string has an orientation along the flexible substrate length and each two adjacent strings of a pair of adjacent strings have orientations in opposite directions. The at least one end-tab jumper is physically and electrically connected to the plurality of adjacent strings, where the at least one end-tab jumper connects the plurality of adjacent strings to form a series circuit.Type: ApplicationFiled: March 15, 2018Publication date: September 19, 2019Inventors: Thomas P. Crocker, Peter Hebert, Rina S. Bardfield, William G. Wise, Dale H. Waterman, Sonya J. Wierman, Joseph A. Lindquist
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Patent number: 10115843Abstract: The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible light reflectance in multijunction solar cells bonded to coverglass, and methods of forming the same. The antireflective coatings include a high index, one or more intermediate index, and low index of refraction dielectric layers. The high index dielectric layer utilizes an ion beam assisted deposition to maximize the density and index of refraction. The intermediate index layer(s) increase the bandwidth of the antireflection coating, thereby improving the performance of the antireflective coating in the infrared spectrum.Type: GrantFiled: July 29, 2016Date of Patent: October 30, 2018Assignee: THE BOEING COMPANYInventors: Philip Chiu, Peter Hebert, Dhananjay Bhusari
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Publication number: 20180166602Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.Type: ApplicationFiled: December 9, 2016Publication date: June 14, 2018Inventors: Christopher M. Fetzer, Peter Hebert
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Publication number: 20170062629Abstract: The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible light reflectance in multijunction solar cells bonded to coverglass, and methods of forming the same. The antireflective coatings include a high index, one or more intermediate index, and low index of refraction dielectric layers. The high index dielectric layer utilizes an ion beam assisted deposition to maximize the density and index of refraction. The intermediate index layer(s) increase the bandwidth of the antireflection coating, thereby improving the performance of the antireflective coating in the infrared spectrum.Type: ApplicationFiled: July 29, 2016Publication date: March 2, 2017Inventors: Philip CHIU, Peter HEBERT, Dhananjay BHUSARI
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Publication number: 20160087114Abstract: The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible light reflectance in multijunction solar cells bonded to coverglass, and methods of forming the same. The antireflective coatings include a high index, one or more intermediate index, and low index of refraction dielectric layers. The high index dielectric layer utilizes an ion beam assisted deposition to maximize the density and index of refraction. The intermediate index layer(s) increase the bandwidth of the antireflection coating, thereby improving the performance of the antireflective coating in the infrared spectrum.Type: ApplicationFiled: September 18, 2014Publication date: March 24, 2016Inventors: Philip CHIU, Peter HEBERT, Dhananjay BHUSARI
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Patent number: 9153720Abstract: An interconnect includes a first set of connector pads, a second set of connector pads, and a continuous central portion. A first plurality of legs extends at a first angle from the continuous central portion. Each leg of the first plurality of legs is connected to a connector pad of a first set of connector pads. A second plurality of legs extends at a second angle from the continuous central portion. Each leg of the second plurality of legs is connected to a connector pad of the second set of connector pads. Gaps are defined between legs. The gaps enable movement of the first set of connector pads relative to the second set of connector pads.Type: GrantFiled: February 10, 2011Date of Patent: October 6, 2015Assignee: THE BOEING COMPANYInventors: John S. Frost, Randolph J. Brandt, Peter Hebert, Omar Al Taher
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Patent number: 8044295Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.Type: GrantFiled: September 7, 2007Date of Patent: October 25, 2011Assignee: The Boeing Company, Inc.Inventors: Jerry R. Kukulka, Maggy L. Lau, Peter Hebert
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Publication number: 20070295397Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.Type: ApplicationFiled: September 7, 2007Publication date: December 27, 2007Applicant: THE BOEING COMPANY, INC.Inventors: Jerry Kukulka, Maggy Lau, Peter Hebert
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Patent number: 7285720Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.Type: GrantFiled: July 21, 2003Date of Patent: October 23, 2007Assignee: The Boeing Company, Inc.Inventors: Jerry R. Kukulka, Maggy L. Lau, Peter Hebert
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Publication number: 20050016584Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.Type: ApplicationFiled: July 21, 2003Publication date: January 27, 2005Inventors: Jerry Kukulka, Maggy Lau, Peter Hebert
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Publication number: 20050013487Abstract: A system, computer program product and method are provided that smooth handwritten information following the transmission of handwritten data to a second computing device, thereby reducing the memory, processing and communications bandwidth requirements of a first computing device that captured the handwritten information. A system, computer program product and method are also provided for creating new points in the vicinity of at least some of the data points of the handwritten data after transmission of the data, thereby effectively improving the resolution of the handwritten information without increasing the memory, processing and communications bandwidth requirements of the first computing device.Type: ApplicationFiled: August 16, 2004Publication date: January 20, 2005Applicant: Advanced Digital Systems, Inc.Inventors: Gregory Clary, Roger Booth, Christopher DiPierro, Peter Hebert, Jason Priebe, Joseph Tate