Patents by Inventor Peter Hebert

Peter Hebert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11335822
    Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: May 17, 2022
    Assignee: THE BOEING COMPANY
    Inventors: Christopher M. Fetzer, Peter Hebert
  • Publication number: 20200388715
    Abstract: A solar cell design includes fabricating one or more gridlines for extracting photo-current on a front surface of the solar cell, wherein each of the gridlines is a metal grid and a cap layer, and at least a portion of the metal grid is deposited on the cap layer; and controlling an alignment of the metal grid relative to the cap layer, and a width of the cap layer relative to a width of the metal grid, so that a minimum cap edge offset distance value is about 1 ?m or more. The alignment of the metal grid relative to the cap layer and the width of the cap layer relative to the width of the metal grid are controlled at areas on the front surface of the solar cell opposite where welding occurs on a back-side of the solar cell. The alignments and widths of the metal grid relative to the cap layer are controlled by a photomask.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 10, 2020
    Applicant: The Boeing Company
    Inventors: Philip T. Chiu, Peter Hebert, Uming T. Jeng, Christopher M. Fetzer, Moran Haddad, Dennis G. Hom, Joseph P. O'Day
  • Publication number: 20200335648
    Abstract: An interconnect for making electrical connections for a solar cell, wherein the interconnect consists of a single toe, without a second toe connected to the single toe, and with no connected crossbars. A plurality of the interconnects may be placed uniformly across an edge of the solar cell. In one example, three interconnects are placed uniformly across an edge of the solar cell, when the solar cell has an area less than 60 cm2. In another example, four or more interconnects are placed uniformly across an edge of the solar cell, when the solar cell has an area greater than 60 cm2.
    Type: Application
    Filed: April 19, 2019
    Publication date: October 22, 2020
    Applicant: The Boeing Company
    Inventors: Peter Hebert, Philip T. Chiu
  • Patent number: 10763376
    Abstract: A method including forming an interconnect in a metal member. The interconnect includes multiple repeating, nested V-shaped structures forming a continuous central portion. A vertex of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of a next V-shaped structure of the multiple repeating, nested V-shaped structures. The method further includes separating the interconnect from the metal member.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: September 1, 2020
    Assignee: THE BOEING COMPANY
    Inventors: John S. Frost, Randolph J. Brandt, Peter Hebert, Omar Al Taher
  • Publication number: 20200212239
    Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.
    Type: Application
    Filed: March 12, 2020
    Publication date: July 2, 2020
    Applicant: The Boeing Company
    Inventors: Christopher M. Fetzer, Peter Hebert
  • Patent number: 10593818
    Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: March 17, 2020
    Assignee: THE BOEING COMPANY
    Inventors: Christopher M. Fetzer, Peter Hebert
  • Publication number: 20190288638
    Abstract: A rollable solar power module (“RSPM”) is disclosed that includes a flexible substrate, a plurality of adjacent strings of photovoltaic (“PV”) solar cells, and at least one end-tab jumper. The flexible substrate has a flexible substrate length and a top surface that defines. The plurality of adjacent strings are attached on the top surface of the flexible substrate. Each PV solar cell has a perimeter that is a convex polygon. The plurality of adjacent strings are configured to be rollable along the flexible substrate length, where each adjacent string has an orientation along the flexible substrate length and each two adjacent strings of a pair of adjacent strings have orientations in opposite directions. The at least one end-tab jumper is physically and electrically connected to the plurality of adjacent strings, where the at least one end-tab jumper connects the plurality of adjacent strings to form a series circuit.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 19, 2019
    Inventors: Thomas P. Crocker, Peter Hebert, Rina S. Bardfield, William G. Wise, Dale H. Waterman, Sonya J. Wierman, Joseph A. Lindquist
  • Patent number: 10115843
    Abstract: The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible light reflectance in multijunction solar cells bonded to coverglass, and methods of forming the same. The antireflective coatings include a high index, one or more intermediate index, and low index of refraction dielectric layers. The high index dielectric layer utilizes an ion beam assisted deposition to maximize the density and index of refraction. The intermediate index layer(s) increase the bandwidth of the antireflection coating, thereby improving the performance of the antireflective coating in the infrared spectrum.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: October 30, 2018
    Assignee: THE BOEING COMPANY
    Inventors: Philip Chiu, Peter Hebert, Dhananjay Bhusari
  • Publication number: 20180166602
    Abstract: A multijunction solar cell includes a base substrate comprising a Group IV semiconductor and a dopant of a first carrier type. A patterned emitter is formed at a first surface of the base substrate. The patterned emitter comprises a plurality of well regions doped with a dopant of a second carrier type in the Group IV semiconductor. The base substrate including the patterned emitter form a first solar subcell. The multijunction solar cell further comprises an upper structure comprising one or more additional solar subcells over the first solar subcell. Methods of making a multijunction solar cell are also described.
    Type: Application
    Filed: December 9, 2016
    Publication date: June 14, 2018
    Inventors: Christopher M. Fetzer, Peter Hebert
  • Publication number: 20170062629
    Abstract: The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible light reflectance in multijunction solar cells bonded to coverglass, and methods of forming the same. The antireflective coatings include a high index, one or more intermediate index, and low index of refraction dielectric layers. The high index dielectric layer utilizes an ion beam assisted deposition to maximize the density and index of refraction. The intermediate index layer(s) increase the bandwidth of the antireflection coating, thereby improving the performance of the antireflective coating in the infrared spectrum.
    Type: Application
    Filed: July 29, 2016
    Publication date: March 2, 2017
    Inventors: Philip CHIU, Peter HEBERT, Dhananjay BHUSARI
  • Publication number: 20160087114
    Abstract: The present disclosure generally relates to broadband antireflective coatings for reducing reflection of light in the infrared without compromising visible light reflectance in multijunction solar cells bonded to coverglass, and methods of forming the same. The antireflective coatings include a high index, one or more intermediate index, and low index of refraction dielectric layers. The high index dielectric layer utilizes an ion beam assisted deposition to maximize the density and index of refraction. The intermediate index layer(s) increase the bandwidth of the antireflection coating, thereby improving the performance of the antireflective coating in the infrared spectrum.
    Type: Application
    Filed: September 18, 2014
    Publication date: March 24, 2016
    Inventors: Philip CHIU, Peter HEBERT, Dhananjay BHUSARI
  • Patent number: 9153720
    Abstract: An interconnect includes a first set of connector pads, a second set of connector pads, and a continuous central portion. A first plurality of legs extends at a first angle from the continuous central portion. Each leg of the first plurality of legs is connected to a connector pad of a first set of connector pads. A second plurality of legs extends at a second angle from the continuous central portion. Each leg of the second plurality of legs is connected to a connector pad of the second set of connector pads. Gaps are defined between legs. The gaps enable movement of the first set of connector pads relative to the second set of connector pads.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: October 6, 2015
    Assignee: THE BOEING COMPANY
    Inventors: John S. Frost, Randolph J. Brandt, Peter Hebert, Omar Al Taher
  • Patent number: 8044295
    Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: October 25, 2011
    Assignee: The Boeing Company, Inc.
    Inventors: Jerry R. Kukulka, Maggy L. Lau, Peter Hebert
  • Publication number: 20070295397
    Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.
    Type: Application
    Filed: September 7, 2007
    Publication date: December 27, 2007
    Applicant: THE BOEING COMPANY, INC.
    Inventors: Jerry Kukulka, Maggy Lau, Peter Hebert
  • Patent number: 7285720
    Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: October 23, 2007
    Assignee: The Boeing Company, Inc.
    Inventors: Jerry R. Kukulka, Maggy L. Lau, Peter Hebert
  • Publication number: 20050016584
    Abstract: A solar cell has an active semiconductor structure and a back electrical contact overlying and contacting an active semiconductor structure back side. A front electrical contact is applied overlying and contacting the active semiconductor structure front side. The front electrical contact has multiple layers including a titanium layer overlying and contacting the active semiconductor structure front side, a diffusion layer overlying and contacting the titanium layer, a barrier layer overlying and contacting the diffusion layer, and a joining layer overlying and contacting the barrier layer. The front electrical contact may be applied by sequentially vacuum depositing the titanium layer, the diffusion layer, the barrier layer, and the joining layer in a vacuum deposition apparatus in a single pumpdown from ambient pressure. A front electrical lead is affixed overlying and contacting an attachment pad region of the front electrical contact.
    Type: Application
    Filed: July 21, 2003
    Publication date: January 27, 2005
    Inventors: Jerry Kukulka, Maggy Lau, Peter Hebert
  • Publication number: 20050013487
    Abstract: A system, computer program product and method are provided that smooth handwritten information following the transmission of handwritten data to a second computing device, thereby reducing the memory, processing and communications bandwidth requirements of a first computing device that captured the handwritten information. A system, computer program product and method are also provided for creating new points in the vicinity of at least some of the data points of the handwritten data after transmission of the data, thereby effectively improving the resolution of the handwritten information without increasing the memory, processing and communications bandwidth requirements of the first computing device.
    Type: Application
    Filed: August 16, 2004
    Publication date: January 20, 2005
    Applicant: Advanced Digital Systems, Inc.
    Inventors: Gregory Clary, Roger Booth, Christopher DiPierro, Peter Hebert, Jason Priebe, Joseph Tate