Patents by Inventor Peter Heisen

Peter Heisen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060270279
    Abstract: An electrical connector apparatus and method for connecting circuit traces on two or more independent circuit board assemblies. A compressible elastomeric member is wrapped with a flexible circuit assembly having a plurality of independent circuit traces, with each circuit trace including a pair of raised electrical contacts. The compressible member with the electrical circuit wrapped over it is supported by a holder assembly. The holder assembly is secured to one of a pair of adjacently positioned independent printed circuit assemblies. The compressible member is held by the holder assembly so that it is compressed against both of the printed circuit board assemblies. The raised electrical contacts electrically contact traces on each of the printed circuit assemblies to complete the electrical connections between the circuit assemblies.
    Type: Application
    Filed: May 31, 2005
    Publication date: November 30, 2006
    Inventors: Peter Heisen, Julio Navarro
  • Publication number: 20050219137
    Abstract: A phased array antenna module for use in the gigahertz bandwidth. The module includes a metallic core with a pair of chip carrier assemblies secured to opposite sides of the core. The core has an internal waveguide with a signal splitter for directing electromagnetic wave energy evenly to the two chip carrier assemblies. A flexible, cylindrical connector assembly electrically couples the chip carrier assemblies to an aperture board. The aperture board includes a plurality of dipole antenna radiating elements. The module core is coupled directly to a cold plate. A direct thermal path is created between the chip carrier assemblies, the module core and the cold plate for highly efficient cooling of the electronic components on the chip carrier assemblies.
    Type: Application
    Filed: May 31, 2005
    Publication date: October 6, 2005
    Inventors: Peter Heisen, Julio Navarro, Ming Chen