Patents by Inventor Peter Herren

Peter Herren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090199518
    Abstract: Disclosed is a means for penetrating portion packaging, especially a capsule (2), which contains and extractable material. Said means comprises perforation elements (7, 8) that are provided with a plurality of openings (9) and allow a shell of the capsule (2) to be pierced. The openings (9) are disposed in such a way on a lead-through surface which extends at an angle to the direction of perforation that the openings (9) form a punched screen structure. The perforation elements (7, 8) are embodied as a member that has several faces, one of which is a lead-through surface. Preferably, the lead-through surface on the extraction side is formed by a foil section that is provided with the openings (9).
    Type: Application
    Filed: August 24, 2007
    Publication date: August 13, 2009
    Inventors: Louis Deuber, Peter Herren, Kees Aardenburg
  • Patent number: 6593541
    Abstract: Laser machining is often carried out using special machines or apparatus, with the workpieces having to be finished afterwards using appropriately equipped cutting machine tools. According to the invention, a laser beam (5) is supplied on the head-stock (17) of a machine tool (13), by means of a beam control tube (12). Said beam radiates into a focussing lens (35) at an articulation point (D). Said articulation point (D) is precisely guided and held in place in a centring cone (36) with its focussing lens (35) located underneath. The laser-machining head can be removed from the headstock (17) by means of a swivel mechanism and the machine (13) can carry out cutting operations in the usual way. The laser-machining operations are carried out before the cutting work in the processing cycle, a zero-offset being provided between the laser machining and the cutting work, correcting any system errors with the help of a computer.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: July 15, 2003
    Assignee: Bystronic Laser AG
    Inventor: Peter Herren
  • Patent number: 5516998
    Abstract: A laser beam machining process and apparatus, applicable to laser beam perforation and cutting, in which a laser beam is directed onto a wall (4) of a component (6) to be machined from one side of the said wall and emerges on the other side thereof following the machining operation. According to the invention, a disk (16) which is opaque to the laser beam is placed on the other side of the wall on the path followed by the laser beam when it emerges and performs a rotary movement, so as to stop the emerging laser beam and in this way protect the walls (8) adjacent to the machined wall against the impacts of the emergent laser beam.
    Type: Grant
    Filed: December 28, 1993
    Date of Patent: May 14, 1996
    Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation "SNECMA"
    Inventors: Herve L. Chatelain, Peter Herren, Peter Thompson
  • Patent number: 4420739
    Abstract: A liquid-cooled electrical assembly containing an arrangement for cooling at least one electrical component under current flow. In this assembly, liquid coolant flows into an inlet in the cooling arrangement and the heated-up coolant is removed through an outlet. In order to increase the power handling capacity of such an arrangement over that of known arrangements having similar dimensions, a cooler is constructed from sheet-like or layer-like cooling elements, each of which have an entrance or inlet opening and an exit or outlet opening for the liquid coolant. The cooling elements are stacked together in alternating fashion with the electrical components so that the entrance openings and exit openings of the cooling elements are in direct connection with the inlet and outlet of the whole cooler. This kind of assembly will find many preferred applications when they are constructed as resistors or power semiconductors.
    Type: Grant
    Filed: August 31, 1981
    Date of Patent: December 13, 1983
    Inventor: Peter Herren