Abstract: To protect the structural layers from being eroded in the etching process, a protection layer is deposited on the exposed structural layers of the micromirror. The protection layer is deposited before etching and removed after etching.

Abstract: Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.

Abstract: A micromirror array comprises micromirrors of different properties for use particularly in display systems. Micromirrors of different properties can be arranged within the micromirror array according to a predetermined pattern, or randomly. However, it is advantageous to arrange the micromirrors with different properties within the micromirror array neither in complete order nor complete in random.

Abstract: The spatial light modulator of the present invention comprises an array of micromirrors, each of which has a reflective deflectable mirror plate. A set of posts are provided for holding the mirror plates on a substrate, but not all micromirrors of the micromirror array have posts.

Abstract: Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.

Abstract: The spatial light modulator of the present invention comprises an array of micromirrors, each of which has a reflective deflectable mirror plate. A set of posts are provided for holding the mirror plates on a substrate, but not all micromirrors of the micromirror array have posts.

Abstract: Disclosed herein is a micromirror-based display system having an improved contrast ratio with the deflection of the micromirrors accomplished through one addressing electrode associate with the micromirror.

Abstract: The etching of a material in a vapor phase etchant is disclosed where a vapor phase etchant is provided to an etching chamber at a total gas pressure of 10 Torr or more, preferably 20 Torr or even 200 Torr or more. The vapor phase etchant can be gaseous acid etchant, a noble gas halide or an interhalogen. The sample/workpiece that is etched can be, for example, a semiconductor device or MEMS device, etc. The material that is etched/removed by the vapor phase etchant is preferably silicon and the vapor phase etchant is preferably provided along with one or more diluents. Another feature of the etching system includes the ability to accurately determine the end point of the etch step, such as by creating an impedance at the exit of the etching chamber (or downstream thereof) so that when the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined.

Abstract: The spatial light modulator of the present invention comprises an array of micromirrors, each of which has a reflective deflectable mirror plate. A set of posts are provided for holding the mirror plates on a substrate, but not all micromirrors of the micromirror array have posts.

Abstract: A micromirror array comprises micromirrors of different properties for use particularly in display systems. Micromirrors of different properties can be arranged within the micromirror array according to a predetermined pattern, or randomly. However, it is advantageous to arrange the micromirrors with different properties within the micromirror array neither in complete order nor complete in random.

Abstract: The spatial light modulator of the present invention comprises an array of micromirrors, each of which has a reflective deflectable mirror plate. A set of posts are provided for holding the mirror plates on a substrate, but not all micromirrors of the micromirror array have posts.

Abstract: To protect the structural layers from being eroded in the etching process, a protection layer is deposited on the exposed structural layers of the micromirror. The protection layer is deposited before etching and removed after etching.

Abstract: Disclosed herein is a micromirror array device that comprises an array of reflective deflectable mirror plates each being associated with one single addressing electrode to be deflected to an ON state angle. A light transmissive electrode is disposed proximate to the mirror plates for deflecting the mirror plates to a non-zero OFF angle. The mirror plates are arranged in the array with a center-to-centre distance of 10.17 microns or less.

Abstract: Disclosed herein is a micromirror-based display system having an improved contrast ratio with the deflection of the micromirrors accomplished through one addressing electrode associate with the micromirror.

Abstract: A micro-mirror that comprises a substrate, a hinge structure formed on the substrate and a mirror plate attached to the hinge structure is provided for use in display systems. The mirror plate is capable of rotating from a non-deflected resting state to a state that is at least 14° degrees. In operation, the micro-mirror switches between an “ON”-state and “OFF”-state, which are defined in accordance with a rotational position of the mirror plate. The OFF state can be a non-deflected position of the micro-mirror (generally parallel to the substrate), the same angle (though opposite direction) as the ON state, or an angle less than the ON state (though in the opposite direction). Reflected light from the “ON” and “OFF” states are thus separated and the contrast ratio is improved.

Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material.

Abstract: The etching of a material in a vapor phase etchant is disclosed where a vapor phase etchant is provided to an etching chamber at a total gas pressure of 10 Torr or more, preferably 20 Torr or even 200 Torr or more. The vapor phase etchant can be gaseous acid etchant, a noble gas halide or an interhalogen. The sample/workpiece that is etched can be, for example, a semiconductor device or MEMS device, etc. The material that is etched/removed by the vapor phase etchant is preferably silicon and the vapor phase etchant is preferably provided along with one or more diluents. Another feature of the etching system includes the ability to accurately determine the end point of the etch step, such as by creating an impedance at the exit of the etching chamber (or downstream thereof) so that when the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined.