Patents by Inventor Peter Hillman

Peter Hillman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220215512
    Abstract: Methods and systems for defocusing a rendered computer-generated image are presented. Pixel values for a pixel array are determined from a scene description. A blur amount for each pixel is determined based on a lens function that determines a kernel shape or a vignette shape. A blur amount and blur transparency value are determined for the pixel based on the lens function and pixel depth. A convolution range comprising pixels adjacent to the pixel is determined based on the blur amount. A blend color value is determined for the pixel based on the color value of the pixel, color values of pixels in the convolution range, and the blur transparency value. The blend color value is scaled based on the blend color value and a modified pixel color value is determined from scaled blend color values.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Inventor: Peter Hillman
  • Patent number: 11361939
    Abstract: Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include an adapter coupled with the remote plasma unit. The adapter may include a first end and a second end opposite the first end. The adapter may define a central channel through the adapter. The adapter may define an exit from a second channel at the second end, and the adapter may define an exit from a third channel at the second end. The central channel, the second channel, and the third channel may each be fluidly isolated from one another within the adapter.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: June 14, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Publication number: 20220148894
    Abstract: Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume.
    Type: Application
    Filed: January 25, 2022
    Publication date: May 12, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Patent number: 11328437
    Abstract: Methods and systems for defocusing a rendered computer-generated image are presented. Pixel values for a pixel array are determined from a scene description. A blur amount for each pixel is determined based on a lens function representing a lens shape and/or effect. A blur amount and blur transparency value are determined for the pixel based on the lens function and pixel depth. A convolution range comprising pixels adjacent to the pixel is determined based on the blur amount. A blend color value is determined for the pixel based on the color value of the pixel, color values of pixels in the convolution range, and the blur transparency value. The blend color value is scaled based on the blend color value and a modified pixel color value is determined from scaled blend color values.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: May 10, 2022
    Assignee: Weta Digital Limited
    Inventor: Peter Hillman
  • Patent number: 11308586
    Abstract: Methods and systems for applying a vignette effect to a rendered computer-generated image are presented. A kernel image including a kernel shape is overlaid on a control image including a vignette shape, creating a region where the kernel shape and control image overlap. A region of the rendered image corresponding to the overlapping region is blurred based on the shape of the overlapping region. A vignetting factor indicating a loss in intensity as a result of the blurring is computed based on the area of the overlapping region and the area of the kernel shape. The intensity of the blurred region is scaled upward based on the vignetting factor. The position of the kernel image on the control shape is shifted, resulting in a new overlapping region. Blurring and intensity compensation are performed for the region of the rendered image corresponding to the new overlapping region.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: April 19, 2022
    Assignee: Unity Technologies SF
    Inventor: Peter Hillman
  • Patent number: 11276559
    Abstract: Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include an adapter coupled with the remote plasma unit. The adapter may include a first end and a second end opposite the first end. The adapter may define a central channel through the adapter. The adapter may define an exit from a second channel at the second end, and the adapter may define an exit from a third channel at the second end. The central channel, the second channel, and the third channel may each be fluidly isolated from one another within the adapter.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: March 15, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Patent number: 11276590
    Abstract: Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: March 15, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Publication number: 20220076437
    Abstract: Methods and systems for defocusing a rendered computer-generated image are presented. Pixel values for a pixel array are determined from a scene description. A blur amount for each pixel is determined based on a lens function representing a lens shape and/or effect. A blur amount and blur transparency value are determined for the pixel based on the lens function and pixel depth. A convolution range comprising pixels adjacent to the pixel is determined based on the blur amount. A blend color value is determined for the pixel based on the color value of the pixel, color values of pixels in the convolution range, and the blur transparency value. The blend color value is scaled based on the blend color value and a modified pixel color value is determined from scaled blend color values.
    Type: Application
    Filed: October 30, 2020
    Publication date: March 10, 2022
    Inventor: Peter Hillman
  • Publication number: 20220076382
    Abstract: Methods and systems for applying a vignette effect to a rendered computer-generated image are presented. A kernel image including a kernel shape is overlaid on a control image including a vignette shape, creating a region where the kernel shape and control image overlap. A region of the rendered image corresponding to the overlapping region is blurred based on the shape of the overlapping region. A vignetting factor indicating a loss in intensity as a result of the blurring is computed based on the area of the overlapping region and the area of the kernel shape. The intensity of the blurred region is scaled upward based on the vignetting factor. The position of the kernel image on the control shape is shifted, resulting in a new overlapping region. Blurring and intensity compensation are performed for the region of the rendered image corresponding to the new overlapping region.
    Type: Application
    Filed: October 30, 2020
    Publication date: March 10, 2022
    Inventor: Peter Hillman
  • Publication number: 20220005224
    Abstract: Embodiments provide for automated detection of a calibration object within a recorded image. In some embodiments, a system receives an original image from a camera, wherein the original image includes at least a portion of a calibration chart. The system further derives a working image from the original image. The system further determines regions in the working image, wherein each region comprises a group of pixels having values within a predetermined criterion. The system further analyzes two or more of the regions to identify a candidate calibration chart in the working image. The system further identifies at least one region within the candidate calibration chart as a patch. The system further predicts a location of one or more additional patches based on at least the identified patch.
    Type: Application
    Filed: October 7, 2020
    Publication date: January 6, 2022
    Applicant: Weta Digital Limited
    Inventor: Peter Hillman
  • Patent number: 11164724
    Abstract: Embodiments of the present disclosure generally provide improved methods for processing substrates with improved process stability, increased mean wafers between clean, and/or improved within wafer uniformity. One embodiment provides a method for seasoning one or more chamber components in a process chamber. The method includes placing a dummy substrate in the process chamber, flowing a processing gas mixture to the process chamber to react with the dummy substrate and generate a byproduct on the dummy substrate, and annealing the dummy substrate to sublimate the byproduct while at least one purge conduit of the process chamber is closed.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: November 2, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sang Won Kang, Nicholas Celeste, Dmitry Lubomirsky, Peter Hillman, Douglas Brenton Hayden, Dongqing Yang
  • Patent number: 11101136
    Abstract: Embodiments of the present technology may include a method of etching. The method may include mixing plasma effluents with a gas in a first section of a chamber to form a first mixture. The method may also include flowing the first mixture to a substrate in a second section of the chamber. The first section and the second section may include nickel plated material. The method may further include reacting the first mixture with the substrate to etch a first layer selectively over a second layer. In addition, the method may include forming a second mixture including products from reacting the first mixture with the substrate.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: August 24, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Dongqing Yang, Tien Fak Tan, Peter Hillman, Lala Zhu, Nitin K. Ingle, Dmitry Lubomirsky, Christopher Snedigar, Ming Xia
  • Publication number: 20190311883
    Abstract: Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include an adapter coupled with the remote plasma unit. The adapter may include a first end and a second end opposite the first end. The adapter may define a central channel through the adapter. The adapter may define an exit from a second channel at the second end, and the adapter may define an exit from a third channel at the second end. The central channel, the second channel, and the third channel may each be fluidly isolated from one another within the adapter.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 10, 2019
    Applicant: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Publication number: 20190272998
    Abstract: Embodiments of the present technology may include a method of etching. The method may include mixing plasma effluents with a gas in a first section of a chamber to form a first mixture. The method may also include flowing the first mixture to a substrate in a second section of the chamber. The first section and the second section may include nickel plated material. The method may further include reacting the first mixture with the substrate to etch a first layer selectively over a second layer. In addition, the method may include forming a second mixture including products from reacting the first mixture with the substrate.
    Type: Application
    Filed: May 20, 2019
    Publication date: September 5, 2019
    Applicant: Applied Materials, Inc.
    Inventors: Dongqing Yang, Tien Fak Tan, Peter Hillman, Lala Zhu, Nitin K. Ingle, Dmitry Lubomirsky, Christopher Snedigar, Ming Xia
  • Patent number: 10297458
    Abstract: Embodiments of the present technology may include a method of etching. The method may include mixing plasma effluents with a gas in a first section of a chamber to form a first mixture. The method may also include flowing the first mixture to a substrate in a second section of the chamber. The first section and the second section may include nickel plated material. The method may further include reacting the first mixture with the substrate to etch a first layer selectively over a second layer. In addition, the method may include forming a second mixture including products from reacting the first mixture with the substrate.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: May 21, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Dongqing Yang, Tien Fak Tan, Peter Hillman, Lala Zhu, Nitin K. Ingle, Dmitry Lubomirsky, Christopher Snedigar, Ming Xia
  • Publication number: 20190043726
    Abstract: Embodiments of the present technology may include a method of etching. The method may include mixing plasma effluents with a gas in a first section of a chamber to form a first mixture. The method may also include flowing the first mixture to a substrate in a second section of the chamber. The first section and the second section may include nickel plated material. The method may further include reacting the first mixture with the substrate to etch a first layer selectively over a second layer. In addition, the method may include forming a second mixture including products from reacting the first mixture with the substrate.
    Type: Application
    Filed: August 7, 2017
    Publication date: February 7, 2019
    Applicant: Applied Materials, Inc.
    Inventors: Dongqing Yang, Tien Fak Tan, Peter Hillman, Lala Zhu, Nitin K. Ingle, Dmitry Lubomirsky, Christopher Snedigar, Ming Xia
  • Publication number: 20180337057
    Abstract: Exemplary semiconductor processing systems may include a processing chamber, and may include a remote plasma unit coupled with the processing chamber. Exemplary systems may also include an adapter coupled with the remote plasma unit. The adapter may include a first end and a second end opposite the first end. The adapter may define a central channel through the adapter. The adapter may define an exit from a second channel at the second end, and the adapter may define an exit from a third channel at the second end. The central channel, the second channel, and the third channel may each be fluidly isolated from one another within the adapter.
    Type: Application
    Filed: May 17, 2017
    Publication date: November 22, 2018
    Applicant: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Publication number: 20180337074
    Abstract: Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume.
    Type: Application
    Filed: May 17, 2017
    Publication date: November 22, 2018
    Applicant: Applied Materials, Inc.
    Inventors: Mehmet Tugrul Samir, Dongqing Yang, Dmitry Lubomirsky, Peter Hillman, Soonam Park, Martin Yue Choy, Lala Zhu
  • Publication number: 20180337021
    Abstract: Embodiments of the present disclosure generally provide improved methods for processing substrates with improved process stability, increased mean wafers between clean, and/or improved within wafer uniformity. One embodiment provides a method for seasoning one or more chamber components in a process chamber. The method includes placing a dummy substrate in the process chamber, flowing a processing gas mixture to the process chamber to react with the dummy substrate and generate a byproduct on the dummy substrate, and annealing the dummy substrate to sublimate the byproduct while at least one purge conduit of the process chamber is closed.
    Type: Application
    Filed: June 5, 2018
    Publication date: November 22, 2018
    Inventors: Sang Won Kang, Nicholas Celeste, Dmitry Lubomirsky, Peter Hillman, Douglas Brenton Hayden, Dongqing Yang
  • Patent number: 10008366
    Abstract: Embodiments of the present disclosure generally provide improved methods for processing substrates with improved process stability, increased mean wafers between clean, and/or improved within wafer uniformity. One embodiment provides a method for seasoning one or more chamber components in a process chamber. The method includes placing a dummy substrate in the process chamber, flowing a processing gas mixture to the process chamber to react with the dummy substrate and generate a byproduct on the dummy substrate, and annealing the dummy substrate to sublimate the byproduct while at least one purge conduit of the process chamber is closed.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: June 26, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Sang Won Kang, Nicholas Celeste, Dmitry Lubomirsky, Peter Hillman, Douglas Brenton Hayden, Dongqing Yang