Abstract: A power semiconductor module arrangement includes two or more individual semiconductor devices arranged on a base layer. Each semiconductor device includes a lead frame, a semiconductor body arranged on the lead frame, and a molding material enclosing the semiconductor body and at least part of the lead frame. A frame is arranged on the base layer such that the frame surrounds the two or more individual semiconductor devices. A casting compound at least partly fills a capacity formed by the base layer and the frame, such that the casting compound at least partly encloses the two or more individual semiconductor devices.

Abstract: A coffee maker including a frame; a water reservoir connected to the frame; a peristaltic pump connected to the water reservoir; and a heater connected to the peristaltic pump. The frame comprises a coffee pod holder for removably holding a coffee grounds containing pod. Hot water can be received from the heater into the coffee grounds containing pod and liquid coffee can pass out of the coffee grounds containing pod.