Patents by Inventor Peter Holbrook

Peter Holbrook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5703599
    Abstract: An offset RF interconnect structure for interconnecting an active array radiating aperture to a transmit/receive (T/R) module sub-array, wherein the corresponding input/output (I/O) ports lie on different lattices. The interconnect structure employs dielectric-filled slabline transmission line, which includes a center conductor wire conductor bent to form the offset interconnection between two ports misaligned in two dimensions. The structure includes a dielectric housing that is formed by injection molding about the center slabline wire conductor. The offset interconnect structure can be integrated with an in-line coaxial interconnect structure.
    Type: Grant
    Filed: February 26, 1996
    Date of Patent: December 30, 1997
    Assignee: Hughes Electronics
    Inventors: Clifton Quan, Peter Holbrook, Bill Batterton, Pat Fitzgerald, Dan Roper, Min Takaki