Patents by Inventor Peter Hopton
Peter Hopton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12022638Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: January 26, 2017Date of Patent: June 25, 2024Assignee: Iceotope Group LimitedInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Patent number: 10306804Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: June 10, 2016Date of Patent: May 28, 2019Assignee: Iceotope LimitedInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Publication number: 20180288906Abstract: A cooling system for cooling of a heat generating electrical component, in particular to reduce the likelihood of overheating of electrical components or chemical breakdown of coolant fluid. The cooling system has a coolant liquid to absorb excess energy from the heat generating electrical component, the coolant liquid having an energy input threshold above which chemical breakdown of the coolant liquid occurs. A cooling module defines a volume containing the coolant liquid, wherein the heat generating electrical component is mounted within the volume and immersed in the coolant liquid. A power input is arranged to supply power into the cooling module to the heat generating electrical component, and a power regulator is provided external to the volume of the cooling module and connected to the power input so as to regulate the power supplied into the cooling module.Type: ApplicationFiled: October 3, 2016Publication date: October 4, 2018Inventors: Peter Hopton, Keith Deakin, Jason Bent, Neil Edmunds, David Amos
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Publication number: 20170150649Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: January 26, 2017Publication date: May 25, 2017Inventors: Daniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
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Patent number: 9516791Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: January 22, 2013Date of Patent: December 6, 2016Assignee: ICEOTOPE LIMITEDInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Publication number: 20160286693Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: June 10, 2016Publication date: September 29, 2016Inventors: Daniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
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Publication number: 20160262287Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: May 16, 2016Publication date: September 8, 2016Inventors: Daniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
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Patent number: 9392727Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: March 1, 2013Date of Patent: July 12, 2016Assignee: ICEOTOPE LIMITEDInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Publication number: 20130208421Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: March 1, 2013Publication date: August 15, 2013Applicant: ICEOTOPE LIMITEDInventors: Daniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
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Publication number: 20130146273Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: January 22, 2013Publication date: June 13, 2013Inventors: Daniel CHESTER, Peter HOPTON, Jason BENT, Keith DEAKIN
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Patent number: 8369090Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: GrantFiled: May 11, 2010Date of Patent: February 5, 2013Assignee: Iceotope LimitedInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Publication number: 20100290190Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.Type: ApplicationFiled: May 11, 2010Publication date: November 18, 2010Applicant: ICEOTOPE LIMITEDInventors: Daniel Chester, Peter Hopton, Jason Bent, Keith Deakin
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Publication number: 20070109742Abstract: A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the interior of the container, and a serial data connection is provided between the processing board and the exterior of the container.Type: ApplicationFiled: November 16, 2006Publication date: May 17, 2007Inventors: Peter Hopton, Simon Bown