Abstract: According to various embodiments, there is provided a method for fabricating a semiconductor package, the method including forming a cap structure and a pillar from a first wafer; bonding the first wafer to a second wafer; and filling a gap between the pillar and the cap structure with a mold compound.

Abstract: According to various embodiments, there is provided a motion measurement device including a first proof mass and a second proof mass, each of the first proof mass and the second proof mass configured to be at least partially rotatable in-plane; a pair of resonators arranged between the first proof mass and the second proof mass; wherein a first resonator of the pair of resonators is configured to resonate at a first frequency and a second resonator of the pair of resonators is configured to resonate at a second frequency; and a determination circuit configured to determine an acceleration based on the first frequency and the second frequency.

Abstract: According to embodiments of the present invention, an energy harvesting device is provided. The energy harvesting device includes a microchannel arranged to receive a fluid, a bluff body arranged to interact with the fluid flowing through the microchannel to generate a vortex fluid street, and an energy harvesting element arranged to interact with the vortex fluid street to harvest energy from the fluid. According to further embodiments of the present invention, a method of harvesting energy is also provided.