Patents by Inventor Peter J. C. Normington

Peter J. C. Normington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including stacked die
    Patent number: 5397916
    Abstract: Leadframes from a TAB tape having die attached are curved and the free ends of the leads curve back over themselves. A separator, attached to the die, defines a pocket for receiving the free end of the leads. The die and separator form a subassembly which is combined with other subassemblies to make the stack. Sides having an array of conductive contact areas connected in a predetermined pattern are placed against the edges of the die to touch the curved leads which form a resilient contact with the sides. A resilient member is located within the curved leads to support the leads during assembly. In one embodiment, the leads are wrapped around the edges of the die itself. In other embodiments, the leads are wrapped around the edge of the separator. A first construction of the stack facilitates assembly of the stack from the bottom up and a second construction facilitates assembly of the stack from the top down.
    Type: Grant
    Filed: July 26, 1993
    Date of Patent: March 14, 1995
    Inventor: Peter J. C. Normington
  • Semiconductor device including stacked die
    Patent number: 5281852
    Abstract: Leadframes from a TAB tape having die attached are curved so that the free ends of the leads curve back over themselves. A separator, attached to the die, defines a pocket for receiving the free end of the leads. The die and separator form a subassembly which is combined with other subassemblies to make the stack. Sides having an array of conductive contact areas connected in a predetermined pattern are placed against the edges of the die to touch the curved leads which form a resilient contact with the sides. A resilient member can be located within the curved leads to support the leads during assembly. In one embodiment, the leads are wrapped around the edges of the die itself. In other embodiments, the leads are wrapped around the edge of the separator.
    Type: Grant
    Filed: December 10, 1991
    Date of Patent: January 25, 1994
    Inventor: Peter J. C. Normington