Abstract: An electrical device includes first and second terminals and a terminal holder holding the first and second terminals. A first insulation layer is provided between the first and second terminals and a second insulation layer is provided between the first and second terminals. The first and second insulation layers are different materials. The first insulation layer is a base layer and the second insulation layer is a high arc tracking resistance rated layer on the base layer to discourage arc tracking on the first insulation layer.

Abstract: An electrical device includes first and second terminals and a terminal holder holding the first and second terminals. A first insulation layer is provided between the first and second terminals and a second insulation layer is provided between the first and second terminals. The first and second insulation layers are different materials. The first insulation layer is a base layer and the second insulation layer is a high arc tracking resistance rated layer on the base layer to discourage arc tracking on the first insulation layer.

Abstract: A thermal barrier for an electronic component includes an aerogel blanket configured to cover at least a portion of the electronic component and a cover positioned between the aerogel blanket and the electronic component. The aerogel blanket has a top, a bottom and edges therebetween. The bottom is configured to face the electronic component. The cover is a structurally reinforcing fabric affixed to the bottom of the aerogel blanket. The cover inhibits dust migration from the aerogel blanket toward the electronic component.

Abstract: An adhesive arrangement includes an adhesive formed from an adhesive composition, the adhesive composition having a fluoropolymeric material, a functionalized fluoropolymeric material, and a thermoplastic material, and a base layer in contact with the adhesive, the base layer being a perfluoropolymeric material, a composite material, a metal material, or a metallic material. The thermoplastic material is selected from the group consisting of polyamide (PA), polyphenylenesulfide (PPS), polyetheretherketone (PEEK), polyimide (PI), polyimide derivatives such as polyetherimide (PEI), polyaryletherketone (PAEK), polyaryletherketone derivatives, polysulfone, polyethersulfone (PES), polysulfone derivatives, and combinations thereof.

Abstract: Static dissipative articles and processes of producing static dissipative articles are described. The static dissipative article includes a conductor and a dissipative coating over the conductor, the dissipative coating including a polymer matrix and between 0.1 and 10%, by weight, conductive nano-carbons homogenously distributed with the polymer matrix. The dissipative coating has a resistivity of between 106 and 1014 ohm·cm, and the conductive-nano-carbons have an aspect ratio of at least 100. The process of producing a coated article includes blending a polymer powder with between 0.1 and 10%, by weight, conductive nano-carbons to form a micron-level homogenous compound, and extruding the compound onto a conductor to form a dissipative coating over the conductor.

Abstract: An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit includes a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure.

Abstract: An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure.

Abstract: An adhesive arrangement includes an adhesive formed from an adhesive composition having a thermoplastic material and a melt-processable perfluoropolymeric material. The adhesive arrangement further includes a base layer in contact with the adhesive. The thermoplastic material is polyetherimide (PEI), polyphenylenesulfide (PPS), polyaryletherketone (PAEK) including polyetheretherketone (PEEK), polyamide (PA), and/or polysulfone derivatives including polysulfone. The base layer is a perfluoropolymeric material, a composite material, a metal material, a metallic material, another suitable material, or a combination thereof.

Abstract: An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure.

Abstract: An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit comprises a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure.

Abstract: A circuit board assembly includes first and second circuit boards that each have a substrate and a conductive circuit layer positioned on the substrate. The first and second circuit boards are arranged such that the conductive circuit layers face each other across a gap. Thermal conductor pillars extend lengths across the gap between the conductive circuit layers of the first and second circuit boards. The thermal conductor pillars include opposite first and second ends that are engaged in thermal contact with the conductive circuit layers of the first and second circuit boards, respectively. The thermal conductor pillars provide thermal pathways for heat to travel between the first and second circuit boards.

Abstract: A connector including a pair of shells mated together along an interface that extends in a longitudinal direction. The pair of shells form a passage therebetween for conveying an electrical current and/or optical communication therethrough. Each shell includes an outer surface and a side projection that extends along the outer surface in substantially the longitudinal direction. The side projection has a ledge that projects from the outer surface and faces away from the interface. The connector also includes a coupling component that is configured to move along the shells in the longitudinal direction and engage the side projections. The coupling component has a slot configured to receive both side projections therein and is at least partially defined by a slot edge. The slot edge engages each ledge when the coupling component is moved over the side projections. The slot edge presses the side projections toward each other to secure the shells together.

Abstract: A main body includes a plurality of holes formed therein a main clip and includes an exterior contact portion positioned exterior to the main body, a first carrier strip connected to the exterior contact portion and located within the main body and a plurality of clips extending from this carrier strip, each position within a corresponding hole formed in the main body. A slave clip includes a carrier strip located within the main body and a plurality of clips extending from the carrier strip, each positioned within a corresponding hole of the main body to make the corresponding one of the clips of the main clip. The pair of the clips formed within each hole form a terminal to allow terminal portions of a grounding wire to be connected therein. A cap having a plurality of holes corresponding in position and size to the holes formed in the main body may be frictionally engaged in a hollow portion of the main body to complete the assembly. The same potential block (e.g.

Abstract: A main body includes a plurality of holes formed therein a main clip and includes an exterior contact portion positioned exterior to the main body, a first carrier strip connected to the exterior contact portion and located within the main body and a plurality of clips extending from this carrier strip, each position within a corresponding hole formed in the main body. A slave clip includes a carrier strip located within the main body and a plurality of clips extending from the carrier strip, each positioned within a corresponding hole of the main body to make the corresponding one of the clips of the main clip. The pair of the clips formed within each hole form a terminal to allow terminal portions of a grounding wire to be connected therein. A cap having a plurality of holes corresponding in position and size to the holes formed in the main body may be frictionally engaged in a hollow portion of the main body to complete the assembly. The same potential block (e.g.

Abstract: A main body includes a plurality of holes formed therein a main clip and includes an exterior contact portion positioned exterior to the main body, a first carrier strip connected to the exterior contact portion and located within the main body and a plurality of clips extending from this carrier strip, each position within a corresponding hole formed in the main body. A slave clip includes a carrier strip located within the main body and a plurality of clips extending from the carrier strip, each positioned within a corresponding hole of the main body to make the corresponding one of the clips of the main clip. The pair of the clips formed within each hole form a terminal to allow terminal portions of a grounding wire to be connected therein. A cap having a plurality of holes corresponding in position and size to the holes formed in the main body may be frictionally engaged in a hollow portion of the main body to complete the assembly. The same potential block (e.g.

Abstract: A mass termination connector (2) having a low profile backshell which may be efficiently stacked. A wiring assembly (24) having conductors (26) extend through a braid (10) and a backshell adapter body (6) to a connector housing (4). The braid is attached to the exterior of the adapter body, removed from the interior compartment, to protect the wiring assembly from chafing during shock and vibration.