Abstract: An optical fiber cable comprises a plurality of buffer tubes, a hollow-core optical fiber disposed within one of the plurality of buffer tubes, and a central strength member. The plurality of buffer tubes are helically stranded about the central strength member, where a diameter d of the central strength member and a lay length l of the plurality of buffer tubes around the central strength member satisfy the following inequality: d?0.075l?6.875. A cable jacket surrounds the plurality of buffer tubes, where a radius of curvature of the hollow-core optical fiber, when the optical fiber cable is kept straight at a temperature of 20° C., is 200 mm or greater.

Abstract: An optical fiber cable includes a hollow-core optical fiber. The cable is configured to have a low excess fiber length (EFL) of the hollow-core fiber. The cable is further configured to maintain a high minimum bending radius of the hollow-core fiber to prevent permanent damage to the hollow-core fiber during installation and operation of the cable.

Abstract: An optical fiber cable includes a hollow-core optical fiber. The cable is configured to have a low excess fiber length (EFL) of the hollow-core fiber. The cable is further configured to maintain a high minimum bending radius of the hollow-core fiber to prevent permanent damage to the hollow-core fiber during installation and operation of the cable.

Abstract: An optical fiber cable includes a hollow-core optical fiber. The cable is configured to have a low excess fiber length (EFL) of the hollow-core fiber. The cable is further configured to maintain a high minimum bending radius of the hollow-core fiber to prevent permanent damage to the hollow-core fiber during installation and operation of the cable.

Abstract: An optical fiber cable comprises a plurality of buffer tubes, a hollow-core optical fiber disposed within one of the plurality of buffer tubes, and a central strength member. The plurality of buffer tubes are helically stranded about the central strength member, where a diameter d of the central strength member and a lay length l of the plurality of buffer tubes around the central strength member satisfy the following inequality: d?0.075l?6.875. A cable jacket surrounds the plurality of buffer tubes, where a radius of curvature of the hollow-core optical fiber, when the optical fiber cable is kept straight at a temperature of 20° C., is 200 mm or greater.

Abstract: An optical fiber cable comprises a plurality of buffer tubes, a hollow-core optical fiber disposed within one of the plurality of buffer tubes, and a central strength member. The plurality of buffer tubes are helically stranded about the central strength member, where a diameter d of the central strength member and a lay length l of the plurality of buffer tubes around the central strength member satisfy the following inequality: d?0.075l?6.875. A cable jacket surrounds the plurality of buffer tubes, where a radius of curvature of the hollow-core optical fiber, when the optical fiber cable is kept straight at a temperature of 20° C., is 200 mm or greater.

Abstract: Circuits, methods, and apparatus where a dongle or adapter may provide continuous power in the event of a disconnection of a charging device. One example may provide a dongle having a charge storage circuit. A charging device connected to the dongle may be used to power an accessory also connected to the dongle. Following a disconnection of the charging device, the dongle may use the charger storage circuit to provide power to the accessory for a first duration. After the first duration, a host device also connected to the dongle may provide power to the accessory via the dongle.

Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads.

Abstract: A circuit board includes conductive traces being sandwiched by an upper insulating layer and a lower insulating layer, a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other, and isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor.

Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads.

Abstract: A circuit board includes conductive traces being sandwiched by an upper insulating layer and a lower insulating layer, a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other, and isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor.

Abstract: Circuits, methods, and apparatus where a dongle or adapter may provide continuous power in the event of a disconnection of a charging device. One example may provide a dongle having a charge storage circuit. A charging device connected to the dongle may be used to power an accessory also connected to the dongle. Following a disconnection of the charging device, the dongle may use the charger storage circuit to provide power to the accessory for a first duration. After the first duration, a host device also connected to the dongle may provide power to the accessory via the dongle.

Abstract: A rigid spring unit is constructed of coil springs and a top grid comprising a plurality of wires, including a first group or pair of parallel wires spaced apart a distance less than the diameter of the top coil of each spring. A second group of three wires, at right angles to the first pair, includes a pair of outside wires spaced apart a distance less than the diameter of the top coil of the spring and a locking wire intermediate the outside wires. The top coil of each spring includes indentations that permit the top coil to be seated from below, in a pre-stressed, woven fashion into the wires of the top grid.