Abstract: A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).

Abstract: A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).

Abstract: An approach for assembling and repairing probe assemblies using laser welding includes aligning a beam element to a post element on a probe substrate. The beam element is positioned in contact with the post element on the probe substrate. The beam element is then attached to the post element on the probe substrate by laser welding the beam element to the post element on the probe substrate. The approach may include the use of a vacuum capillary pickup tool to align and position the beam element. The vacuum capillary pickup tool may also operate in conjunction with a laser beam delivery system for guiding the laser beam to the correct location for welding and also to assist in removing gases and debris attributable to the laser welding process. The approach allows probe elements to be connected directly to a probe substrate without requiring an intermediate layer.

Abstract: A probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer. The reinforcing layer may be a composite reinforcing layer that includes multiple layers of material to achieve a particular result. According to one embodiment of the invention, the reinforcing layer includes a powder layer disposed on the substrate and an adhesive layer formed on the powder layer. The composite reinforcing layer may be compliant to allow the probes to flex and move as intended, without limiting deflection capability. The composite reinforcing layer may be removable to allow access to probes for repair.

Abstract: An approach for assembling and repairing probe assemblies using laser welding includes aligning a beam element to a post element on a probe substrate. The beam element is positioned in contact with the post element on the probe substrate. The beam element is then attached to the post element on the probe substrate by laser welding the beam element to the post element on the probe substrate. The approach may include the use of a vacuum capillary pickup tool to align and position the beam element. The vacuum capillary pickup tool may also operate in conjunction with a laser beam delivery system for guiding the laser beam to the correct location for welding and also to assist in removing gases and debris attributable to the laser welding process. The approach allows probe elements to be connected directly to a probe substrate without requiring an intermediate layer.