Patents by Inventor Peter J. KleinBeernink

Peter J. KleinBeernink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6823586
    Abstract: A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of the invention the package is mounted on its side such that leads of one side (now the bottom) of the butterfly package are connected either directly to surface mount pads on the PCB or project through and connected to through-holes in the PCB. The leads on the other side (now top) are connected to a flex circuit or ribbon cable. A heatsink can be attached to the package without impinging significantly on the PCB layout.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: November 30, 2004
    Assignee: Meriton Networks Inc.
    Inventors: Eric Lutkiewicz, Bob Van Leeuwen, Peter J. KleinBeernink
  • Publication number: 20030223203
    Abstract: A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of the invention the package is mounted on its side such that leads of one side (now the bottom) of the butterfly package are connected either directly to surface mount pads on the PCB or project through and connected to through-holes in the PCB. The leads on the other side (now top) are connected to a flex circuit or ribbon cable. A heatsink can be attached to the package without impinging significantly on the PCB layout.
    Type: Application
    Filed: May 27, 2003
    Publication date: December 4, 2003
    Inventors: Eric Lutkiewicz, Bob Van Leeuwen, Peter J. KleinBeernink