Abstract: A signal transmission line, includes: a coaxial electrical connector comprising a coaxial electrical connector inner conductor and a coaxial outer conductor; a coaxial cable comprising a coaxial inner conductor and a coaxial outer conductor; and a section of resistive cable disposed between the coaxial cable and the coaxial connector, the section of resistive cable comprising an electrically thin resistive layer disposed between the coaxial cable inner conductor and a section outer conductor. The coaxial cable inner conductor is fastened to the coaxial electrical connector inner conductor.

Abstract: A signal transmission line, includes: a coaxial electrical connector comprising a coaxial electrical connector inner conductor and a coaxial outer conductor; a coaxial cable comprising a coaxial inner conductor and a coaxial outer conductor; and a section of resistive cable disposed between the coaxial cable and the coaxial connector, the section of resistive cable comprising an electrically thin resistive layer disposed between the coaxial cable inner conductor and a section outer conductor. The coaxial cable inner conductor is fastened to the coaxial electrical connector inner conductor.

Abstract: A method and apparatus with a first substrate made of an inorganic material having at least one signal trace and a second substrate made of an organic material having at least one signal trace, at least one interconnect and at least one reception cavity. The first and second substrates are mechanically joined and the at least one signal trace of the first substrate is electrically connected to the at least one signal trace of the second substrate. The first substrate overlays the reception cavity.

Abstract: An application specific heat sink assembly is presented in which a heat-dissipating substrate is selected of a particular size, shape and material in order to meet predetermined heat-dissipating requirements and a heat-dissipating stud is selected or formed of a particular size, shape and material in order to meet predetermined requirements. The heat-dissipating substrate and heat-dissipating stud form a heat sink assembly having application specific features selected to optimize the heat-dissipating, CTE matching, environmental resistance requirements, low mass requirements, size, machinability, cost structure and other desirable features of a particular application for dissipating heat from an electronic component.