Patents by Inventor Peter J. Oakley

Peter J. Oakley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding leads to semiconductor devices
    Patent number: 4587395
    Abstract: In the bumped-tape automated bonding process for connecting leads to a semi-conductor circuit device, it is known to form the bumps on the free ends of the conductive leads of the tape by plating or etching. In the present invention, the free ends of the leads on the tape are heated by means of a laser beam to melt the ends of the leads so that surface tension forces form the liquid-phase end of each lead into a ball, constituting the bonding bump. The bumped ends of the leads of the tape are then bonded to terminals of the semiconductor device by conventional means.
    Type: Grant
    Filed: December 6, 1983
    Date of Patent: May 6, 1986
    Assignee: The Welding Institute
    Inventors: Peter J. Oakley, Norman R. Stockham, Heidi M. Miller