Abstract: Combined heat and power (CHP) systems and related methods are disclosed herein. In some embodiments, the CHP system includes a combustion component and a power cell operably coupled to the combustion component. The power cell can include a first heat exchanger thermally coupled to the combustion component to receive heat; a second heat exchanger; and an electricity generation component with a first portion thermally coupled to the first heat exchanger and a second portion thermally coupled to the second heat exchanger. The electricity generation component is positioned to receive at least a portion of the heat received at the first heat exchanger and generate an electrical output using the received heat. To recycle unused heat from the power cell, the second heat exchanger can be thermally coupleable to a third heat exchanger in a residential heating appliance.

Abstract: Various disclosed embodiments include thermionic energy converters and electronic circuitry for generating pulses for igniting plasma in a hermetic package of a thermionic energy converter. In various embodiments, an illustrative thermionic energy converter includes a hermetic package charged with a non-cesium gas additive. The hermetic package is configured to route into the hermetic package pulses for igniting plasma in the hermetic package. A cesium reservoir is disposed in the hermetic package. A cathode is disposed in the hermetic package and an anode is disposed in the hermetic package.

Abstract: Various disclosed embodiments include elements for mitigating electron reflection in a vacuum electronic device, vacuum electronic devices that incorporate elements for mitigating electron reflection, and methods of fabricating elements for reducing reflection of electrons off an electrode. An illustrative electrode assembly includes an electrode. Elements are configured to reduce reflection of electrons off the electrode.

Abstract: Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.

Abstract: Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.