Abstract: Several embodiments for mass airflow sensors are illustrated herein. In each case a sensing element (11) for the mass airflow sensor (10, 34, 50) is provided on a first portion (18) of a thin flexible film substrate (19) while an extension of this substrate provides integral electrical conductive metallizations (24) that connect the sensing element (11) to associated sensor electronic components (21) mounted on a second portion (23) of the film substrate remotely located from the first film portion. This eliminates the need for individual soldered wire connections to connect the sensing element to its associated electronics. In addition, housing portions (12, 13) for the sensor (10, 34, 50) mate together and provide protection for both the sensing element (11) and the sensor electronics (21) thereby providing an integral sensor module including the sensing element and its associated electronics.

Abstract: A pressure transducer (10; 10') having a silicon diaphragm (14; 14') and an insulating glass base (11; 11'). Surfaces (16, 12; 16', 12') of the diaphragm and glass base are anodically bonded together to form a hermetic seal for an internal reference cavity (24; 24') therein and also to provide hermetic protection for critical areas (70, 77; 70', 80, 81) on the silicon diaphragm. A plurality of semiconductor components are synthesized in an area (70; 70') in the silicon diaphragm. A plurality of conductors (71-73; 71'-73') are embedded (sealed) in the glass base so as to provide external electrical access to the semiconductor components without disrupting the hermetic seal provided between the silicon diaphragm and the glass base.

Abstract: A capacitive pressure transducer is disclosed in which a preformed metallic component is embedded in a nonconductive base substrate and acts as a first capacitor electrode. A silicon diaphragm acts as a second pressure sensing capacitor electrode whose spacing from the first electrode is determined by sensed pressure. The preformed metallic component forming the first capacitor electrode has an integral projecting portion which extends through the base substrate and provides an externally accessible electrical connection to the first electrode. A top external surface of the first electrode is ground flat so that it is coplanar with surrounding coplanar portions of a top surface of the base substrate. An additional preformed metallic conductor means is embedded in the base substrate and provides an externally accessible bottom side connection to the silicon diaphragm which is bonded to the base top surface.