Abstract: An infra-red temperature sensor for sensing the temperature of a medium includes a housing; a thermal infra-red sensor element having a predetermined field of view and disposed in the housing; and a diaphragm closing the housing spaced along an axis from and in the field of view of the thermal sensor element for absorbing on its outer surface heat from the medium and emitting radiation from its inner surface to the thermal sensor element representative of the temperature of the medium.

Abstract: A method of making a radiation sensor wherein a plurality of thermopiles are formed on one wafer and a plurality of packages for the thermopiles are formed in another wafer. Each package includes a formed well covered by a window. The two wafers are bonded in a controlled gas or vacuum environment such that each thermopile resides in the well below the window of a package.

Abstract: A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly.

Abstract: A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly.