Patents by Inventor Peter J. Van Emmerik

Peter J. Van Emmerik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8313015
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: November 20, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • Publication number: 20120031877
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Application
    Filed: October 13, 2011
    Publication date: February 9, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • Patent number: 8066170
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: November 29, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • Publication number: 20110073635
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Application
    Filed: June 8, 2009
    Publication date: March 31, 2011
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik