Abstract: An alignment fixture for use in sealing integrated circuit packages including a body having rectangular alignment cavities therein for receiving components of integrated circuit packages. The body is inclined at an angle relative to a horizontal reference plane. The rectangular alignment cavities are rotated at 451/2 angle relative to a longitudinal axis of the body.

Abstract: A ceramic chip carrier package for integrated circuits is described which provides reduced interlead capacitance. A cavity for the placement of the integrated circuit chip is centrally located on a substrate. The leads of the package are bridged between the cavity and the outer periphery of the substrate. The leads are bonded to the substrate using adhesive glass placed on the substrate at the outer periphery of the cavity and at the outer periphery of the substrate. Sealing glass is placed on the outer periphery of the substrate over the leads to provide a bonding material for a lid to the package. The area between the cavity and the outer periphery of the substrate has no adhesive or sealing glass which thus provides an air dielectric between the leads so that interlead capacitance is reduced.