Abstract: The invention concerns a detaping process for a protective foil taped onto a front-side of a semiconductor wafer, this detaping process comprising the successive steps of: A) introducing the wafer and the protective foil taped onto the front-side of the semiconductor wafer into an electrically dissipative liquid or into an electrically dissipative solid-state medium having a flowing behavior substantially similar to the one of a liquid; B) removing the protective foil when the wafer is into the electrically dissipative liquid or into the electrically dissipative solid-state medium. In another implementing mode, the detaping process comprises, during the removing of the protective foil, a spray of an electrically dissipative liquid in the region adjacent to the detaping line between the semiconductor wafer and the protective foil or an injection of an electrically dissipative liquid along this detaping line.

Abstract: A manufacturing method for electronic components (1) including a coil (10), in which a distributing device (34), carrying a pay-out reel (24) on which is wound a winding wire (6), places the wire (6) in contiguous regular turns (8) onto a core (2), this method being characterised in that a flux of ionised air is forced to flow onto the coil (10) during manufacturing to remove electrostatic charges produced during the winding of the coil.

Abstract: A suction catheter for sucking body fluids at surgical operations. The catheter comprises an inner and an outer tube manufactured through a coextruding procedure and which form an integrated unit. The outside of the inner tube and/or the inside of the outer tube is provided with longitudinal profilings, which form channels between the inner and outer tube. The channels communicate with the ambient air and provide an air supply to the suction channel when the catheter opening is stopped up.