Abstract: The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.

Abstract: The present invention provides a transport member for transporting strip-like elements to be treated in a bath. The transport member is provided with a horizontally oriented endless carrier belt with resilient wire-like clamping members attached thereto by means of their own resilience for the purpose of clamping the strip-like elements at the position of wire ends of the clamping members. Wire ends of adjacent clamping members are provided opposite each other for clamping the strip-like elements therebetween.

Abstract: The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.

Abstract: A device for treating a band-shaped substrate with a liquid, including: a conveying system including a winding system guiding the band-shaped substrate in a spiral path around the winding system with at least one winding; a first pulley rotatable about a first axis of rotation guiding the at least one winding of the band-shaped substrate through a first angle of deflection around part of the circumference of the first pulley, and a second pulley guiding the at least one winding of the band-shaped substrate through a second angle of deflection around part of the circumference of the second pulley, which is rotatable about a second axis of rotation, for each winding; and a bath of the liquid. The band-shaped substrate extends through the liquid over at least part of the length of the at least one winding. The second axis of rotation of each second pulley makes an angle alpha with the first axis of rotation.

Abstract: The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of immersing the substrate with the pattern present thereon in an electrolytic bath, electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate. The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.