Abstract: A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and a pad to receive electrical control signals. The ASIC includes a communication link and a plurality of transmission lines that transmit electrical signals to the MEMS die.

Abstract: In some examples, a fluid die includes a fluid nozzle, a first latch, a second latch, and a timing circuit comprising a counter and a comparator. The timing circuit is to trigger the first latch, at a first predetermined time instant from an edge of a firing pulse, to store a first test result obtained based on a voltage measured across the fluid nozzle, and trigger the second latch, at a second predetermined time instant from the edge of the firing pulse, to store a second test result obtained based on a voltage measured across the fluid nozzle.

Abstract: A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and a pad to receive electrical control signals. The ASIC includes a communication link and a plurality of transmission lines that transmit electrical signals to the MEMS die.

Abstract: An example device in accordance with an aspect of the present disclosure includes modules to generate an input signal, apply the input signal to an ink sample to obtain an ink signal, compare the ink signal to a reference value, and identify whether the ink signal is consistent with an ink signature. A module may be contained on an inkjet printhead die.

Abstract: In some examples, a printing system comprises a plurality of microelectromechanical systems (MEMS) dies comprising printing fluid jets, a printhead assembly (PHA) application specific integrated circuit (ASIC), and a substrate comprising the plurality of MEMS dies and the PHA ASIC. The PHA ASIC is to process image data into a plurality of data signals that define a firing pattern, and transmit the data signals through transmission lines on the substrate to the plurality of MEMS dies. The printing fluid jets of the plurality of MEMS dies are to fire in response to the data signals.

Abstract: In some examples, a method of regulating a temperature of a printhead includes charging, in a first state of a temperature regulator, an analog memory to a reference voltage that corresponds to a predetermined temperature of the printhead. The temperature regulator monitors, during a second state, the temperature of the printhead, the monitoring including measuring a thermal voltage representing an actual temperature of at least a first local area of a plurality of local areas of the printhead, and comparing, with a comparator, the reference voltage to the thermal voltage to obtain a comparison result for at least the first local area. Based on the comparison result, a series of warming pulses from a warming pulse circuit to at least the first local area is selectively enabled.

Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

Abstract: In some examples, a printing system comprises a plurality of microelectromechanical systems (MEMS) dies comprising printing fluid jets, a printhead assembly (PHA) application specific integrated circuit (ASIC), and a substrate comprising the plurality of MEMS dies and the PHA ASIC. The PHA ASIC is to process image data into a plurality of data signals that define a firing pattern, and transmit the data signals through transmission lines on the substrate to the plurality of MEMS dies. The printing fluid jets of the plurality of MEMS dies are to fire in response to the data signals.

Abstract: In an example, a print head comprises a nozzle to be activated by a delayed fire pulse that is delayed from an initial fire pulse, a sensor to measure an impedance of the nozzle, and a detector to determine a first time instant following the delayed fire pulse for registering a first impedance measurement by the sensor.

Abstract: In some examples, a method of regulating a temperature of a printhead includes charging, in a first state of a temperature regulator, an analog memory to a reference voltage that corresponds to a predetermined temperature of the printhead. The temperature regulator monitors, during a second state, the temperature of the printhead, the monitoring including measuring a thermal voltage representing an actual temperature of at least a first local area of a plurality of local areas of the printhead, and comparing, with a comparator, the reference voltage to the thermal voltage to obtain a comparison result for at least the first local area. Based on the comparison result, a series of warming pulses from a warming pulse circuit to at least the first local area is selectively enabled.

Abstract: A print head assembly (PHA) includes a microelectromechanical systems (MEMS) die mounted to a substrate with an application specific integrated circuit (ASIC). The die includes an opening defined in the die, a plurality of nozzles adjacent to the opening in fluid communication with the opening, and a pad to receive electrical control signals. The ASIC includes a communication link and a plurality of transmission lines that transmit electrical signals to the MEMS die.

Abstract: In some examples, a fluid die includes a fluid nozzle, a first latch, a second latch, and a timing circuit comprising a counter and a comparator. The timing circuit is to trigger the first latch, at a first predetermined time instant from an edge of a firing pulse, to store a first test result obtained based on a voltage measured across the fluid nozzle, and trigger the second latch, at a second predetermined time instant from the edge of the firing pulse, to store a second test result obtained based on a voltage measured across the fluid nozzle.

Abstract: An apparatus including an analog memory, a temperature sensor, a comparator, and a pulse circuit. The analog memory is charged to a reference voltage corresponding to a predetermined temperature of a printhead. The temperature sensor measures a thermal voltage of at least one of the plurality of local areas of the printhead. The comparator obtains a comparison result by comparing the reference voltage to the thermal voltage. The pulse circuit selectively transmits a series of warming pulses to the at least one of the plurality of local areas of the printhead based on the comparison result.

Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

Abstract: In an example, a piezoelectric printhead assembly includes a micro-electro mechanical system (MEMS) die including a plurality of nozzles. An application-specific integrated circuit (ASIC) die is coupled to the MEMS die by a plurality of wire bonds, wherein each of the wire bonds corresponds to a respective nozzle of the plurality of nozzles. An arbitrary data generator (ADG) on the ASIC is to provide a digital data sequence, and a multiplier is to scale multiple nozzles of the plurality of nozzles.

Abstract: Systems and methods for evaluating the condition of a print nozzle are described. In one example, impedances across the print nozzle are measured. Subsequently, first test result and second test result are determined and registered at a first predetermined time instant and at a second predetermined time instant, respectively. The first test result and the second test result are obtained based on the measured impedances. Based on the first test result and the second test result, the condition of the print nozzle, is determined.

Abstract: A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.

Abstract: In some examples, a printhead die includes a nozzle to be fired by a fire pulse, and a sensor to measure, during a firing of the nozzle by the fire pulse, a measured signal comprising an impedance characteristic of a fluid sample of the nozzle, in response to an input signal applied to the fluid sample. A comparator is to compare the measured signal to a reference value, and a counter is to count over an evaluation interval in response to the comparing indicating that an evaluation criterion is satisfied, and the counter is to stop counting in response to the comparing indicating that the evaluation criterion is not satisfied, a count value of the counter providing an indicator of nozzle chamber operation corresponding to the measured signal.

Abstract: An example device in accordance with an aspect of the present disclosure includes modules to generate an input signal, apply the input signal to an ink sample to obtain an ink signal, compare the ink signal to a reference value, and identify whether the ink signal is consistent with an ink signature. A module may be contained on an inkjet printhead die.

Abstract: An example provides a fluid ejection apparatus including a fluid feed slot along a length of a print head die of the fluid ejection apparatus to supply a fluid to a plurality of drop ejectors, control circuitry adjacent to at least one side of the fluid feed slot to control ejection of drops of fluid from the plurality of drop ejectors, and a single power supply connector at an end of the print head die to supply power to the control circuitry.