Abstract: A light-emitting device (100) is specified, which has a housing (1) with a mounting surface (12) and a housing recess (13), a semiconductor laser diode (2) being arranged in the housing recess, which is intended and embodied to emit laser light (20) in a direction parallel to the mounting surface (12) during operation, an optical element (4) being arranged downstream of the semiconductor laser diode in the beam path of the laser light, the semiconductor laser diode being mounted in the housing in such a way that the laser light has a maximum divergence in a plane parallel to the mounting surface, the optical element having a light-incoupling surface (41), exactly one reflector surface (42) and a light-outcoupling surface (43), the optical element being a one-piece housing cover which completely covers the housing recess in which the semiconductor laser diode is arranged, and the light-outcoupling surface being part of an outer surface of the optical element opposite the mounting surface.

Abstract: In one embodiment, the semiconductor laser comprises a housing in which multiple laser diode chips are encapsulated. The housing comprises a cover panel and/or a lateral wall which is permeable to the generated laser radiation. The cover panel and/or the lateral wall has a light outlet surface with adjacent outlet regions. Each of the outlet regions is paired with precisely one of the laser diode chips. The light outlet surface is arranged downstream of a light outlet plane. The cover panel and/or the lateral wall has a different average thickness in the outlet regions such that the optical wavelength for the laser radiation of all of the laser diode chips is the same up to the light outlet plane with a tolerance of maximally 1.5 ?m.

Abstract: A laser diode chip is described, comprising: an n-type semiconductor region (3), a p-type semiconductor region (5), and an active layer (4) arranged between the n-type semiconductor region (3) and the p-type semiconductor region (5), an n-type contact (9) and a p-type contact (8), at least one heating element (14) arranged on a side of the laser diode chip facing the p-type semiconductor region (5), the heating element (14) functioning as a resistance heater, and at least one metallic seed layer (7, 11), wherein the heating element comprises a part (11) of the seed layer, and wherein the p-type contact (8) is arranged on a further part (7) of the seed layer (7, 11).

Abstract: A light-emitting device (100) is specified, which has a housing (1) with a mounting surface (12) and a housing recess (13), a semiconductor laser diode (2) being arranged in the housing recess, which is intended and embodied to emit laser light (20) in a direction parallel to the mounting surface (12) during operation, an optical element (4) being arranged downstream of the semiconductor laser diode in the beam path of the laser light, the semiconductor laser diode being mounted in the housing in such a way that the laser light has a maximum divergence in a plane parallel to the mounting surface, the optical element having a light-incoupling surface (41), exactly one reflector surface (42) and a light-outcoupling surface (43), the optical element being a one-piece housing cover which completely covers the housing recess in which the semiconductor laser diode is arranged, and the light-outcoupling surface being part of an outer surface of the optical element opposite the mounting surface.

Abstract: A laser module includes a housing with a cavity and a window opening, a side-emitting semiconductor laser diode, arranged in the cavity that emits light radiation in the form of a laser beam, an optical deflection structure that deflects the laser beam, emitted by the semiconductor laser diode, in a direction of the window opening, and an optical output coupling structure arranged in the region of the window opening to output couple the laser beam in a defined direction and/or with a defined emission profile, wherein the optical deflection structure and the optical output coupling structure are configured in one piece in the form of a shared optical component.