Abstract: A semiconductor device may include a plurality of single-photon avalanche diode (SPAD) pixels. The semiconductor device may be a backside device having a substrate at the backside, dielectric layers on the substrate, metal layers interleaved with the dielectric layers, and a through silicon via (TSV) formed in the backside through the substrate and the dielectric layers. TSV seal rings may be formed around the TSV to protect the semiconductor device from moisture and/or water ingress. The TSV seal rings may be coupled to a high-voltage cathode bond pad and be coupled to offset portions of one of the metal layers to reduce leakage and/or parasitic effects due to the voltage difference between the cathode and the substrate. The TSV seal rings may also be merged with die seal rings at the edge of the substrate.

Abstract: A tray assembly includes a tray having a top side, an underside opposite the top side, and a plurality of protrusions extending from the underside. Each protrusion defines a recess in the top side and has a bottom wall and a contoured surface connecting the bottom wall to the top side. The tray assembly also includes a diffuser in the form of a plate with a plurality of apertures therethrough. The diffuser is couplable to the tray and positionable a spaced distance above the top side of the tray.

Abstract: A telecommunications enclosure is disclosed. In one example the enclosure includes a gel block actuator that is capable of applying compressive load and positive tensile load to the gel block.

Abstract: Embodiments of the invention include a method of singulating IC chips from a wafer. The method can include receiving the wafer having a substrate formed under active layers. The wafer includes a chip that includes a first portion of the active layers and a first portion of the substrate. A separation trench is formed by using an etch operation to remove a first segment of the active layers and a first segment of the substrate that are beneath a first separation channel of the wafer. The separation trench separates the first portion of the active layers from a remaining portion of the active layers; and separates the first portion of the substrate from a remaining portion of the substrate. The first IC chip is seperated from the wafer by removing a first section of the remaining portion of the substrate that is underneath the first portion of the substrate.

Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.

Abstract: A telecommunications enclosure is disclosed. In one example the enclosure includes a gel block actuator that is capable of applying compressive load and positive tensile load to the gel block.

Abstract: A cable fixation device (100, 200, 300, 400) includes a base (102, 202) with fastener holes (104), an upright (110, 208) projecting from the base and including a fixation projection (126, 212, 316, 318) having a reduced dimensional portion (128, 214, 324) for receiving a cable tie (152, 222, 326). Protrusions (130, 218, 320) are provided for engaging the cable jacket. Variations on the cable fixation device include a fixation element (130, 218, 320) which can slide and/or rotate about a vertical rod; a plate element (304) which includes a plurality of fixation projections extending between two rods; and a plurality of uprights (208) integrally formed with the base and including forwardly and rearwardly projecting projections. The base (102, 202) and the fixation projections (126, 212, 316, 318) can be made from molded plastic.

Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.

Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.

Abstract: A tray assembly includes a tray having a top side, an underside opposite the top side, and a plurality of protrusions extending from the underside. Each protrusion defines a recess in the top side and has a bottom wall and a contoured surface connecting the bottom wall to the top side. The tray assembly also includes a diffuser in the form of a plate with a plurality of apertures therethrough. The diffuser is couplable to the tray and positionable a spaced distance above the top side of the tray.

Abstract: In an embodiment, a method for forming a solder bump includes preparing a transfer mold having a solder pillar extending from a mold substrate and through a first photoresist layer and having a shape partially defined by a second photoresist layer that is removed prior to transfer of the solder. In an embodiment, the mold substrate is flexible. In an embodiment, the transfer mold is flexible. In an embodiment, the method includes providing a device substrate having a wettable pad. In an embodiment, the method includes placing the transfer mold and the device substrate into aligned contact such that the solder pillar is in contact with the wettable pad. In an embodiment, the method includes forming a metallic bond between the solder pillar and the wettable pad. In an embodiment, the method includes removing the mold substrate and first photoresist layer.

Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.

Abstract: A telecommunications enclosure is disclosed. In one example the enclosure includes a gel block actuator that is capable of applying compressive load and positive tensile load to the gel block.

Abstract: A cable fixation device (100, 200, 300, 400) includes a base (102, 202) with fastener holes (104), an upright (110, 208) projecting from the base and including a fixation projection (126, 212, 316, 318) having a reduced dimensional portion (128, 214, 324) for receiving a cable tie (152, 222, 326). Protrusions (130, 218, 320) are provided for engaging the cable jacket. Variations on the cable fixation device include a fixation element (130, 218, 320) which can slide and/or rotate about a vertical rod; a plate element (304) which includes a plurality of fixation projections extending between two rods; and a plurality of uprights (208) integrally formed with the base and including forwardly and rearwardly projecting projections. The base (102, 202) and the fixation projections (126, 212, 316, 318) can be made from molded plastic.

Abstract: A cable fixation device (100, 200, 300, 400) includes a base (102, 202) with fastener holes (104), an upright (110, 208) projecting from the base and including a fixation projection (126, 212, 316, 318) having a reduced dimensional portion (128, 214, 324) for receiving a cable tie (152, 222, 326). Protrusions (130, 218, 320) are provided for engaging the cable jacket. Variations on the cable fixation device include a fixation element (130, 218, 320) which can slide and/or rotate about a vertical rod; a plate element (304) which includes a plurality of fixation projections extending between two rods; and a plurality of uprights (208) integrally formed with the base and including forwardly and rearwardly projecting projections. The base (102, 202) and the fixation projections (126, 212, 316, 318) can be made from molded plastic.

Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.

Abstract: A clamp assembly includes a first clamp half-piece and a second clamp half-piece. In one example, the clamp half-pieces are identically shaped. In one example, each of the clamp half-pieces has at least one integral pin and at least one aperture. The first and second clamp half-pieces are pivotally connected to each other via a first snap-fit interface in which the integral pin of the first clamp half-piece snap-fits into the at least one aperture of the second clamp half-piece. The clamp assembly can also include a link arm connected to the first clamp half-piece via a second snap-fit interface. A lever arm can also be included that is pivotally connected to the link arm via a third snap-fit interface. The clamp assembly does not require separate link pins or other parts and only includes four components: the clamp half-pieces, the link arm, and the lever arm.

Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.