Abstract: A crimp machine is provided and includes an anvil having a lower die having a lower forming surface. The anvil is configured to support a crimp barrel of a terminal that receives a wire. The crimp machine includes a press having an upper die having an upper forming surface. The press is movable relative to the anvil during a crimping process to connect the crimp barrel to the wire. A crimp zone is defined between the upper forming surface and the lower forming surface. The crimp machine includes a vision system positioned to view the crimp zone. The vision system includes an imaging device configured to image the crimp barrel of the terminal and the wire. The vision system operates the imaging device to capture an image prior to the crimping process for performing a validation pre-check prior to the crimping process.

Abstract: A terminal inspection system for a crimp machine includes a vision device configured to image a terminal being inspected and generate a digital image of the terminal. The terminal inspection system includes a terminal inspection module communicatively coupled to the vision device to receive the digital image of the terminal as an input image. The terminal inspection module has an anchor image. The terminal inspection module compares the input image to the anchor image and performs semantic segmentation between the input image and the anchor image to generate an output image. The output image shows differences between the input image and the anchor image to identify any potential defects.

Abstract: A press head for a press machine used to press-fit a connector to a printed circuit board includes a press motor operable in a pressing operation, a driver assembly operably coupled to the press motor and movable during the pressing operation, and a press anvil operably coupled to the driver assembly and movable by the driver assembly during the pressing operation. The press anvil has a load cell housing holding a load cell and a contact plate coupled to the load cell housing and engaging the load cell. The contact plate has a contact surface configured to engage the connector or a seating tool for the connector and configured to press the connector toward the printed circuit board during the pressing operation. The load cell measures a pressing load of the contact plate during the pressing operation.

Abstract: A crimp machine is provided and includes an anvil having a lower die having a lower forming surface. The anvil is configured to support a crimp barrel of a terminal that receives a wire. The crimp machine includes a press having an upper die having an upper forming surface. The press is movable relative to the anvil during a crimping process to connect the crimp barrel to the wire. A crimp zone is defined between the upper forming surface and the lower forming surface. The crimp machine includes a vision system positioned to view the crimp zone. The vision system includes an imaging device configured to image the crimp barrel of the terminal and the wire. The vision system operates the imaging device to capture an image prior to the crimping process for performing a validation pre-check prior to the crimping process.

Abstract: A press head for a press machine used to press-fit a connector to a printed circuit board includes a press motor operable in a pressing operation, a driver assembly operably coupled to the press motor and movable during the pressing operation, and a press anvil operably coupled to the driver assembly and movable by the driver assembly during the pressing operation. The press anvil has a load cell housing holding a load cell and a contact plate coupled to the load cell housing and engaging the load cell. The contact plate has a contact surface configured to engage the connector or a seating tool for the connector and configured to press the connector toward the printed circuit board during the pressing operation. The load cell measures a pressing load of the contact plate during the pressing operation.

Abstract: An apparatus for detecting a location of conductive pins with respect to a circuit board during an assembly process using a press tool to mate the circuit board and the conductive pins includes a detector housing holding a plurality of switches aligned with corresponding conductive pins, wherein the detector housing is configured to be mounted to the press tool used during the assembly process. The switches change state based on the location of the conductive pins with respect to the circuit board. The apparatus further includes a sensor electrically coupled with the plurality of switches, wherein the sensor monitors the change of state of each switch to indicate that the respective conductive pins are properly mated with the circuit board.

Abstract: An apparatus for detecting a location of conductive pins with respect to a circuit board during an assembly process using a press tool to mate the circuit board and the conductive pins includes a detector housing holding a plurality of switches aligned with corresponding conductive pins, wherein the detector housing is configured to be mounted to the press tool used during the assembly process. The switches change state based on the location of the conductive pins with respect to the circuit board. The apparatus further includes a sensor electrically coupled with the plurality of switches, wherein the sensor monitors the change of state of each switch to indicate that the respective conductive pins are properly mated with the circuit board.