Patents by Inventor Peter John Hopper

Peter John Hopper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT DEVICE PACKAGE WITH THERMAL ISOLATION
    Publication number: 20150001694
    Abstract: An integrated circuit (IC) package having an IC device; a heat source operably associated with said IC device; an electrical substrate operably electrically connected to the IC device; and a thermal isolation mat positioned between the IC device and the electrical substrate and having a base surface, a ceiling structure and a plurality of spaced apart elongate members positioned between the base surface and the ceiling structure. Other heat isolation structures are also disclosed.
    Type: Application
    Filed: July 1, 2013
    Publication date: January 1, 2015
    Inventors: Peter John Hopper, Roozbeh Parsa