Patents by Inventor Peter Joseph Hubert Drummen

Peter Joseph Hubert Drummen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR
    Publication number: 20230108902
    Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 6, 2023
    Inventors: Leo van Gemert, Peter Joseph Hubert Drummen
  • Selective underfill assembly and method therefor
    Patent number: 11557491
    Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: January 17, 2023
    Assignee: NXP B.V.
    Inventors: Leo van Gemert, Peter Joseph Hubert Drummen
  • SELECTIVE UNDERFILL ASSEMBLY AND METHOD THEREFOR
    Publication number: 20210134612
    Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 6, 2021
    Inventors: Leo van Gemert, Peter Joseph Hubert Drummen
  • Underbump metallization dimension variation with improved reliability
    Patent number: 10825789
    Abstract: One embodiment of a packaged semiconductor device includes: a redistributed layer (RDL) structure formed over an active side of a semiconductor die embedded in mold compound, the RDL structure includes a plurality of solder ball pads that in turn includes: a set of first solder ball pads located on a front side of the packaged semiconductor device within a footprint of the semiconductor die, and a set of second solder ball pads located on the front side of the packaged semiconductor device outside of the footprint of the semiconductor die, each first solder ball pad includes a first center portion having a first diameter measured between opposite outer edges of the first center portion, each second solder ball pad includes a second center portion having a second diameter measured between opposite outer edges of the second center portion, and the first diameter is smaller than the second diameter.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 3, 2020
    Assignee: NXP B.V.
    Inventors: Leo Van Gemert, Adrianus Buijsman, Jeroen Johannes Maria Zaal, Michiel Van Soestbergen, Peter Joseph Hubert Drummen