Abstract: A novel method and apparatus has been developed for testing optical circuit modules. More particularly, with the present invention, a given test pack is adapted to “simultaneously” test a plurality of DUT's, by simultaneously apply a given optical signal to each of the plurality of DUT's and allowing each of the DUT's to simultaneously undergo its own testing; the test pack then serially queries each of the DUT's to obtain test results and, if desired, can provide feedback to one or more of the DUT's, whereby the DUT's can be calibrated with the assistance of the test pack. In one preferred form of the invention, all of the plurality of DUT's simultaneously undergoing testing on a given test pack are housed in a single environmental enclosure, permitting all of the DUT's to be simultaneously brought “up to temperature” so as to increase testing throughput.

Abstract: A novel method and apparatus has been developed for testing optical circuit modules. More particularly, with the present invention, a given test pack is adapted to “simultaneously” test a plurality of DUT's, by simultaneously apply a given optical signal to each of the plurality of DUT's and allowing each of the DUT's to simultaneously undergo its own testing; the test pack then serially queries each of the DUT's to obtain test results and, if desired, can provide feedback to one or more of the DUT's, whereby the DUT's can be calibrated with the assistance of the test pack. In one preferred form of the invention, all of the plurality of DUT's simultaneously undergoing testing on a given test pack are housed in a single environmental enclosure, permitting all of the DUT's to be simultaneously brought “up to temperature” so as to increase testing throughput.

Abstract: A local area of an electronic assembly, including a single electronic component or a cluster of components mounted to a printed wiring board, is cleaned. A shroud is positioned about the local area and aqueous cleaning solution is sprayed on the lead joints of the electronic component. To remove the cleaning liquids, a vacuum is drawn from the shroud through a central baffle which is positioned close to the electronic component. Adjustable gates are provided about the base of the shroud to permit air flow into the shroud. Adjustment of the gates controls turbulence of the cleaning solution and subsequent direction of air flow for drying of the electronic component, leads and board. Shroud/baffle assemblies are selected and nozzle assemblies are tilted to correspond to different sizes of electronic components.