Patents by Inventor PETER KHAI MUM FUNG

PETER KHAI MUM FUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for bonding substrates
    Patent number: 11309278
    Abstract: Methods for bonding substrates used, for example, in substrate-level packaging, are provided herein. In some embodiments, a method for bonding substrates includes: performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate, performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate, positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate, and bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: April 19, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prayudi Lianto, Guan Huei See, Sriskantharajah Thirunavukarasu, Arvind Sundarrajan, Xundong Dai, Peter Khai Mum Fung
  • METHODS FOR BONDING SUBSTRATES
    Publication number: 20200135690
    Abstract: Methods for bonding substrates used, for example, in substrate-level packaging, are provided herein. In some embodiments, a method for bonding substrates includes: performing electrochemical deposition (ECD) to deposit at least one material on each of a first substrate and a second substrate, performing chemical mechanical polishing (CMP) on the first substrate and the second substrate to form a bonding interface on each of the first substrate and the second substrate, positioning the first substrate on the second substrate so that the bonding interface on the first substrate aligns with the bonding interface on the second substrate, and bonding the first substrate to the second substrate using the bonding interface on the first substrate and the bonding interface on the second substrate.
    Type: Application
    Filed: July 24, 2019
    Publication date: April 30, 2020
    Inventors: PRAYUDI LIANTO, GUAN HUEI SEE, SRISKANTHARAJAH THIRUNAVUKARASU, ARVIND SUNDARRAJAN, XUNDONG DAI, PETER KHAI MUM FUNG