Patents by Inventor Peter Kirkpatrick

Peter Kirkpatrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080002988
    Abstract: A driver circuit is coupled to an optical waveguide transmitter. The driver circuit has a current generator that is in series with the transmitter, and a current robbing circuit is coupled to the transmitter. The current robbing circuit is to divert first and second amounts of current from the transmitter, in accordance with predetermined values of first and second bit streams, respectively, in which data is received to be transmitted. Other embodiments are also described and claimed.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Hengju Cheng, Peter Kirkpatrick
  • Publication number: 20070297733
    Abstract: A system is disclosed. The system includes an optical fiber and a transceiver coupled to the optical fiber. The transceiver may operate according to both a single mode operation and a multi-mode operation.
    Type: Application
    Filed: June 26, 2006
    Publication date: December 27, 2007
    Inventors: Thomas Mader, Peter Kirkpatrick, Jan Weem
  • Publication number: 20070274629
    Abstract: A system is disclosed. The system includes an optical waveguide; and an optical transmitter coupled to the optical waveguide. The transmitter includes a optical relay to condition a launch of an optical beam into the optical waveguide to minimize a number of optical modes launched into the optical waveguide.
    Type: Application
    Filed: April 25, 2006
    Publication date: November 29, 2007
    Inventors: Peter Kirkpatrick, Marc Epitaux, Jan Weem, Dana Rose, Mark McDonald
  • Patent number: 7300303
    Abstract: An apparatus comprising a spring retainer attachable to a printed circuit board and a spring having a fixed end attached to the spring retainer and a free end that contacts and exerts a force on the printed circuit board when the spring retainer is attached to the printed circuit board. A process comprising attaching a clamp to a printed circuit board, the clamp comprising a spring retainer and a spring having a fixed end attached to the spring retainer and a free end that is in contact with, and exerts a force on, the printed circuit board; and inserting a flexible circuit with one or more electrical contact pads thereon between the spring and the printed circuit board such that the electrical contact pads of the flexible circuit are pressed by the spring against corresponding electrical contact pads on the printed circuit board.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: November 27, 2007
    Assignee: Intel Corporation
    Inventors: Peter Kirkpatrick, Joshua Oen, Sang Kim, Marc Epitaux, Colm Hunt
  • Publication number: 20070154147
    Abstract: A system is disclosed. The system includes a multimode optical fiber and a network controller coupled to the optical fiber. The network controller includes a receiver and an electrical dispersion compensation (EDC) unit to compensate for modal dispersion in optical signals received from the optical fiber.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Jan Weem, Tom Mader, Peter Kirkpatrick
  • Publication number: 20070147846
    Abstract: An optical communications device has light transmitters of a first wavelength that are coupled to a number of first waveguides of an optical data link, respectively. A second set of light transmitters of a second, different wavelength are coupled to another set of waveguides of the link, respectively. The light transmitters are to transmit data from the same data processing element that is to use the link to communicate with another data processing element. The device also has a set of light detectors of the first wavelength that are coupled to the second set of waveguides, respectively. Another set of light detectors of the second wavelength are coupled to the set of first waveguides, respectively. Other embodiments are also described and claimed.
    Type: Application
    Filed: December 5, 2006
    Publication date: June 28, 2007
    Inventors: Marc Epitaux, Jean-Marc Verdiell, Peter Kirkpatrick, Jan P. Peeters Weem
  • Publication number: 20070147845
    Abstract: A system is disclosed. The system includes a first optical transceiver having a first set of transmitters and a first set of receivers and a second optical transceiver having a second set of transmitters coupled anti-symmetrically to the first set of receivers of the first optical transceiver and a second set of receivers coupled anti-symmetrically to the first set of transmitters of the first optical transceiver.
    Type: Application
    Filed: December 28, 2005
    Publication date: June 28, 2007
    Inventors: Marc Epitaux, Jean-Marc Verdiell, Peter Kirkpatrick, Jan Weem
  • Publication number: 20070072483
    Abstract: An apparatus comprising a spring retainer attachable to a printed circuit board; and a spring having a fixed end and a free end, wherein the fixed end is attached to the spring retainer and the free end is in contact with, and exerts a force on, the printed circuit board when the spring retainer is attached to the printed circuit board.
    Type: Application
    Filed: September 26, 2005
    Publication date: March 29, 2007
    Inventors: Peter Kirkpatrick, Joshua Oen, Sang Kim, Marc Epitaux, Colm Hunt
  • Publication number: 20060118702
    Abstract: Embodiments of the present invention utilize two photodiodes on the same substrate, one illuminated monitor photodiode to monitor an optical beam out of a back facet (or back scattered) of a laser, and one non-illuminated reference photodiode to characterize in real time radio frequency (RF) parameters/performance to control extinction ratio and optical modulation amplitude of the laser beam.
    Type: Application
    Filed: January 11, 2006
    Publication date: June 8, 2006
    Inventors: Joshua Posamentier, Peter Kirkpatrick
  • Publication number: 20050133493
    Abstract: A package for heating a micro-component is disclosed. The package comprises a platform having a resistive heating element integral with the platform. The package further includes a micro-component disposed on the platform.
    Type: Application
    Filed: December 18, 2003
    Publication date: June 23, 2005
    Inventors: Peter Kirkpatrick, Marc Finot
  • Publication number: 20050123251
    Abstract: A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.
    Type: Application
    Filed: January 11, 2005
    Publication date: June 9, 2005
    Inventors: Marc Epitaux, Peter Kirkpatrick, Jean-Marc Verdiell
  • Patent number: 6853287
    Abstract: There is provided a coil and a method for fabricating the same. One embodiment of the coil includes a plurality of traces in one area of a substrate. Each trace has a first end located at a first side of the area, and a second end located at a second side of the area opposite the first side. A plurality of wires couples the plurality of traces to form a coil. Each wire couples the first end of one trace to the second end of another trace located adjacent to the one trace.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: February 8, 2005
    Assignee: Intel Corporation
    Inventors: Peter Kirkpatrick, Thomas Mader, Jean-Marc Verdiell
  • Patent number: 6850144
    Abstract: Accordingly, a coil is described. The coil includes a plurality of traces in one area of a substrate. Each trace has a first end located at a first side of the area, and a second end located at a second side of the area opposite the first side. A plurality of wires couples the plurality of traces to form a coil. Each wire couples the first end of one trace to the second end of another trace located adjacent to the one trace.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: February 1, 2005
    Assignee: Intel Corporation
    Inventors: Peter Kirkpatrick, Thomas Mader, Jean-Marc Verdiell