Patents by Inventor Peter Kortekaas

Peter Kortekaas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENERGY-EFFICIENT EDGE COMPUTING SYSTEM AND ARCHITECTURE-INTERFACING CARRIER MODULE
    Publication number: 20260194939
    Abstract: Described are various embodiments of an energy-efficient edge computing system, and an architecture-interfacing carrier module which is operable therewith or as a standalone unit. Embodiments of the architecture-interfacing carrier module and the energy-efficient edge computing system generally employ a rugged standard, such as a Virtual Path Cross-Connect (VPX) standard or the like, together with a commercial standard, such as a Computer-on-Module express (COMe) standard or the like.
    Type: Application
    Filed: May 31, 2023
    Publication date: July 9, 2026
    Applicant: GREEN EDGE COMPUTING CORP.
    Inventors: Jeffrey MACMILLAN, Peter KORTEKAAS, Justin NAPIER
  • Conduction cooled chassis
    Patent number: 12213285
    Abstract: An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: January 28, 2025
    Assignee: AMETEK, INC.
    Inventors: Peter Kortekaas, Jonathan Anderson, Joo-Han Kim, Brian Hoden
  • CONDUCTION COOLED CHASSIS
    Publication number: 20230025346
    Abstract: An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.
    Type: Application
    Filed: July 22, 2022
    Publication date: January 26, 2023
    Inventors: Peter Kortekaas, Jonathan Anderson, Joo-Han Kim, Brian Hoden