Patents by Inventor Peter Krotov
Peter Krotov has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11444053Abstract: The present disclosure is directed to a compact vertical oven for reflow of solder bumps for backend processes in semiconductor wafer assembly and packaging. This disclosure describes a vertical oven which uses a plurality of wafers (e.g., an example value is 50-100 wafers) in a batch with controlled injection of the reducing agent (e.g. formic acid), resulting in a process largely free of contamination. This disclosure describes controlled formic acid flow through a vertical system using laminar flow technology in a sub-atmospheric pressure environment, which is not currently available in the industry. The efficacy of the process depends on effective formic acid vapor delivery, integrated temperature control during heating and cooling, and careful design of the vapor flow path with exhaust. Zone-dependent reaction dynamics managed by vapor delivery process, two-steps temperature ramp control, and controlled cooling process and formic acid content ensures the effective reaction without any flux.Type: GrantFiled: April 17, 2020Date of Patent: September 13, 2022Assignee: YIELD ENGINEERING SYSTEMS, INC.Inventors: M Ziaul Karim, Randy Hall, Peter Krotov
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Patent number: 11335662Abstract: A solder reflow oven may include a reflow chamber and a plurality of vertically spaced apart wafer-support plates positioned in the reflow chamber. A plurality of semiconductor wafers each including a solder are configured to be disposed in the reflow chamber such that each semiconductor wafer is disposed proximate to, and vertically spaced apart from, a wafer-support plate. Each wafer-support plate may include at least one of liquid-flow channels or resistive heating elements. A control system control the flow of a hot liquid through the channels or activate the heating elements to heat a wafer to a temperature above the solder reflow temperature.Type: GrantFiled: September 2, 2021Date of Patent: May 17, 2022Assignee: YIELD ENGINEERING SYSTEMS, INC.Inventors: M Ziaul Karim, Randy Hall, Peter Krotov
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Publication number: 20210398937Abstract: A solder reflow oven may include a reflow chamber and a plurality of vertically spaced apart wafer-support plates positioned in the reflow chamber. A plurality of semiconductor wafers each including a solder are configured to be disposed in the reflow chamber such that each semiconductor wafer is disposed proximate to, and vertically spaced apart from, a wafer-support plate. Each wafer-support plate may include at least one of liquid-flow channels or resistive heating elements. A control system control the flow of a hot liquid through the channels or activate the heating elements to heat a wafer to a temperature above the solder reflow temperature.Type: ApplicationFiled: September 2, 2021Publication date: December 23, 2021Applicant: Yield Engineering Systems, Inc.Inventors: M Ziaul Karim, Randy Hall, Peter Krotov
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Publication number: 20210265301Abstract: The present disclosure is directed to a compact vertical oven for reflow of solder bumps for backend processes in semiconductor wafer assembly and packaging. This disclosure describes a vertical oven which uses a plurality of wafers (e.g., an example value is 50-100 wafers) in a batch with controlled injection of the reducing agent (e.g. formic acid), resulting in a process largely free of contamination. This disclosure describes controlled formic acid flow through a vertical system using laminar flow technology in a sub-atmospheric pressure environment, which is not currently available in the industry. The efficacy of the process depends on effective formic acid vapor delivery, integrated temperature control during heating and cooling, and careful design of the vapor flow path with exhaust. Zone-dependent reaction dynamics managed by vapor delivery process, two-steps temperature ramp control, and controlled cooling process and formic acid content ensures the effective reaction without any flux.Type: ApplicationFiled: April 17, 2020Publication date: August 26, 2021Inventors: M Ziaul Karim, Randy Hall, Peter Krotov
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Patent number: 10872787Abstract: A semiconductor processing chamber is provided and may include a wafer transfer passage that extends through a chamber wall and has an inner passage surface defining an opening, an insert including an insert inner surface defining an insert opening, and a gas inlet. A first recessed surface of the wafer transfer passage extending at least partially around and outwardly offset from the inner passage surface, a first insert outer surface extending at least partially around and outwardly offset from the insert inner surface, and a first wall surface extending between the inner passage surface and the first recessed surface, at least partially define a gas distribution channel fluidically connected to the gas inlet, the first recessed surface is separated from the first insert outer surface by a first distance and an insert front surface faces and is separated from the first wall surface by a first gap distance.Type: GrantFiled: September 19, 2018Date of Patent: December 22, 2020Assignee: Lam Research CorporationInventors: Panya Wongsenakhum, Peter Krotov
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Patent number: 10186448Abstract: An apparatus for semiconductor processing that includes a pedestal that includes a wafer support surface that includes a plurality of mesas and a pattern of grooves is provided. Each mesa may be bracketed between two or more grooves, each mesa may include a plurality of mesa side walls that intersect, at least in part, with one of the grooves and with a mesa top surface that is a substantially planar surface, the mesa top surfaces may be substantially coplanar with each other, and the mesa top surfaces may be configured to support a wafer during semiconductor operations.Type: GrantFiled: May 13, 2016Date of Patent: January 22, 2019Assignee: Lam Research CorporationInventors: Peter Krotov, Eric H. Lenz
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Publication number: 20190019696Abstract: A semiconductor processing chamber is provided and may include a wafer transfer passage that extends through a chamber wall and has an inner passage surface defining an opening, an insert including an insert inner surface defining an insert opening, and a gas inlet. A first recessed surface of the wafer transfer passage extending at least partially around and outwardly offset from the inner passage surface, a first insert outer surface extending at least partially around and outwardly offset from the insert inner surface, and a first wall surface extending between the inner passage surface and the first recessed surface, at least partially define a gas distribution channel fluidically connected to the gas inlet, the first recessed surface is separated from the first insert outer surface by a first distance and an insert front surface faces and is separated from the first wall surface by a first gap distance.Type: ApplicationFiled: September 19, 2018Publication date: January 17, 2019Inventors: Panya Wongsenakhum, Peter Krotov
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Patent number: 10090174Abstract: A semiconductor processing chamber is provided and may include a wafer transfer passage that extends through a chamber wall and has an inner passage surface defining an opening, an insert including an insert inner surface defining an insert opening, and a gas inlet. A first recessed surface of the wafer transfer passage extending at least partially around and outwardly offset from the inner passage surface, a first insert outer surface extending at least partially around and outwardly offset from the insert inner surface, and a first wall surface extending between the inner passage surface and the first recessed surface, at least partially define a gas distribution channel fluidically connected to the gas inlet, the first recessed surface is separated from the first insert outer surface by a first distance and an insert front surface faces and is separated from the first wall surface by a first gap distance.Type: GrantFiled: March 1, 2016Date of Patent: October 2, 2018Assignee: Lam Research CorporationInventors: Panya Wongsenakhum, Peter Krotov
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Publication number: 20170256424Abstract: A semiconductor processing chamber is provided and may include a wafer transfer passage that extends through a chamber wall and has an inner passage surface defining an opening, an insert including an insert inner surface defining an insert opening, and a gas inlet. A first recessed surface of the wafer transfer passage extending at least partially around and outwardly offset from the inner passage surface, a first insert outer surface extending at least partially around and outwardly offset from the insert inner surface, and a first wall surface extending between the inner passage surface and the first recessed surface, at least partially define a gas distribution channel fluidically connected to the gas inlet, the first recessed surface is separated from the first insert outer surface by a first distance and an insert front surface faces and is separated from the first wall surface by a first gap distance.Type: ApplicationFiled: March 1, 2016Publication date: September 7, 2017Inventors: Panya Wongsenakhum, Peter Krotov
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Publication number: 20170170051Abstract: An apparatus for semiconductor processing that includes a pedestal that includes a wafer support surface that includes a plurality of mesas and a pattern of grooves is provided. Each mesa may be bracketed between two or more grooves, each mesa may include a plurality of mesa side walls that intersect, at least in part, with one of the grooves and with a mesa top surface that is a substantially planar surface, the mesa top surfaces may be substantially coplanar with each other, and the mesa top surfaces may be configured to support a wafer during semiconductor operations.Type: ApplicationFiled: May 13, 2016Publication date: June 15, 2017Inventors: Peter Krotov, Eric H. Lenz
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Publication number: 20130312663Abstract: A vapor delivery apparatus for providing a precursor vapor for a vapor deposition process includes a precursor container for holding a liquid or solid precursor. A first temperature control assembly maintains the precursor container at a first temperature to generate a vapor precursor from the liquid or solid precursor. An isolation valve is coupled to the precursor container, and a specific quantity of the vapor precursor is accumulated in an expansion volume. A fill valve, which is coupled to each of the isolation valve and the expansion volume, controls the flow of the vapor precursor from the precursor container into the expansion volume. A second temperature control assembly maintains the isolation valve at a second temperature greater than the first temperature.Type: ApplicationFiled: May 22, 2012Publication date: November 28, 2013Applicant: Applied Microstructures, Inc.Inventors: Mukul Khosla, Mike Grimes, Peter Krotov, Genny Epshteyn
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Publication number: 20130078375Abstract: An improved deposition source configuration in a process chamber can reduce the overheating in a thin film deposition system.Type: ApplicationFiled: September 13, 2012Publication date: March 28, 2013Inventors: Peter Krotov, Michael Rivkin, Erel Milshtein, Markus E. Beck
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Patent number: 7993457Abstract: An apparatus and method for depositing film on a substrate includes a plurality of conduits that allow by-product and reactant gases to flow past the edge of a substrate. The apparatus and process of the present invention has several advantages for enhanced chamber performance, particularly for micro-volume chambers using pulsed deposition layer processes.Type: GrantFiled: January 23, 2007Date of Patent: August 9, 2011Assignee: Novellus Systems, Inc.Inventors: Peter Krotov, Colin F. Smith
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Publication number: 20090277472Abstract: The present invention pertains to methods for removing unwanted material from a work piece. More specifically, the invention pertains to stripping photoresist material from, e.g., a semiconductor wafer during semiconductor manufacturing. Methods involve implementing a pedestal for supporting a wafer, which pedestal has a low emissivity surface to reduce heat transfer by radiation.Type: ApplicationFiled: May 5, 2009Publication date: November 12, 2009Applicant: NOVELLUS SYSTEMS, INC.Inventors: Michael Rivkin, Peter Krotov
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Publication number: 20080081114Abstract: Uniform fluid delivery to a substrate is provider using a diffuser. The diffuser is designed with a series of fluid (gas and/or liquid) passages of equal effective length/flow resistance, such that as the fluid passes through the diffuser, the gas exits all areas at the same time and with the same mass flux. These passages may not be physically the same, however they have the same effective length and flow resistance. The diffuser can be implemented using single or multiple stacked layers, and from several to many passages. The net effect is a uniform gas curtain to the wafer. Since the passages through the diffuser are effectively the same, the uniform gas curtain to the wafer is not sensitive to the quantity of gas, the gas flow rate or the gas pressure. Additionally, a faceplate can optionally be used to smooth out any jet effects of the diffuser exit holes.Type: ApplicationFiled: October 3, 2006Publication date: April 3, 2008Inventors: William Johanson, John Mazzocco, David Cohen, Thomas M. Pratt, Gary Lind, Peter Krotov
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Patent number: 6758591Abstract: In one embodiment, a mixing device includes a nozzle that is disposed tangent to a wall of a chamber. Gas flowing from the nozzle rotates in the chamber forming a vortex. Another gas may be flown near a middle portion of the chamber, thereby uniformly mixing the two gases. In another embodiment, an evaporation and mixing device includes a nozzle configured to impart rotation to a gas flowing into a chamber. An injector flows a liquid material near a middle portion of the chamber, thereby mixing the gas and the liquid material. A heater may be employed to help evaporate the liquid material.Type: GrantFiled: March 22, 2002Date of Patent: July 6, 2004Assignee: Novellus Systems, Inc.Inventors: Peter Krotov, Colin F. Smith, Randy Hall, Sooyun Joh