Patents by Inventor Peter L. Samevall

Peter L. Samevall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6955740
    Abstract: A laminate to be used in the manufacture of printed circuit boards is formed by contacting one surface of a layer of a conductive foil (e.g. copper foil) with protective-carrier sheeting (e.g., aluminum foil) and the other surface of the conductive foil with a dielectric layer (e.g., prepreg). The contacted layers are stacked and cut to desired dimensions. The process is performed without use of adhesive or mechanical attachment. Consequently, contamination and the occurrence of imperfections in the conductive foil of a laminate to be used in a printed wiring board can be substantially reduced.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: October 18, 2005
    Assignee: Polyclad Laminates, Inc.
    Inventors: Joseph C. Rapuano, Peter L. Samevall, Ronny Varul
  • Publication number: 20030127187
    Abstract: A laminate to be used in the manufacture of printed circuit boards is formed by contacting one surface of a layer of a conductive foil (e.g. copper foil) with protective-carrier sheeting (e.g., aluminum foil) and the other surface of the conductive foil with a dielectric layer (e.g., prepreg). The contacted layers are stacked and cut to desired dimensions. The process is performed without use of adhesive or mechanical attachment. Consequently, contamination and the occurrence of imperfections in the conductive foil of a laminate to be used in a printed wiring board can be substantially reduced.
    Type: Application
    Filed: January 10, 2002
    Publication date: July 10, 2003
    Inventors: Joseph C. Rapuano, Peter L. Samevall, Ronny Varul