Abstract: The present invention relates to a polymer latex for dip-molding applications obtainable by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of ?50° C. to 50° C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, to a method of preparing said polymer latex, to articles made by using said polymer latex and to a method for preparing dip-molded articles from said polymer latex.

Abstract: The present invention relates to a polymer latex for dip-molding applications obtainable by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of ?50° C. to 50° C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, to a method of preparing said polymer latex, to articles made by using said polymer latex and to a method for preparing dip-molded articles from said polymer latex.

Abstract: A pressure sensitive adhesive composition is described. The pressure sensitive adhesive composition includes a polymerization product of a monomer mixture. The monomer mixture includes the following components: (a) at least one alkyl ester of (meth)acrylic acid or cyclic hydrocarbon acrylates; (b) at least one vinyl ester of a C4-C20 carboxylic acid; (c) at least one hydroxyl functional (meth)acrylate monomer, or at least one epoxy functional (meth)acrylate monomer; (d) at least one ureido substituted ethylenically unsaturated monomer; and one or more optional monomer components (e)-(g). The pressure sensitive adhesive composition provides a desirable combination of low and high temperature performance, and good adhesion to both metal and organic polymer surfaces.

Abstract: A pressure sensitive adhesive composition is described. The pressure sensitive adhesive composition includes a polymerization product of a monomer mixture. The monomer mixture includes the following components: (a) at least one alkyl ester of (meth)acrylic acid or cyclic hydrocarbon acrylates; (b) at least one vinyl ester of a C4-C20 carboxylic acid; (c) at least one hydroxyl functional (meth)acrylate monomer, or at least one epoxy functional (meth)acrylate monomer; (d) at least one ureido substituted ethylenically unsaturated monomer; and one or more optional monomer components (e)-(g). The pressure sensitive adhesive composition provides a desirable combination of low and high temperature performance, and good adhesion to both metal and organic polymer surfaces.

Abstract: A pressure sensitive adhesive composition is described. The pressure sensitive adhesive composition includes a polymerization product of a monomer mixture. The monomer mixture includes the following components: (a) at least one alkyl ester of (meth)acrylic acid or cyclic hydrocarbon acrylates; (b) at least one vinyl ester of a C4-C20 carboxylic acid; (c) at least one hydroxyl functional (meth)acrylate monomer, or at least one epoxy functional (meth)acrylate monomer; (d) at least one ureido substituted ethylenically unsaturated monomer; and one or more optional monomer components (e)-(g). The pressure sensitive adhesive composition provides a desirable combination of low and high temperature performance, and good adhesion to both metal and organic polymer surfaces.