Patents by Inventor Peter Leerkamp

Peter Leerkamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090076508
    Abstract: An implant having a substantially solid basic structure and a porous jacket structure at least partially enclosing the basic structure for attachment of cellular tissue wherein the basic structure and the jacket structure are connected integrally to each other and the porous jacket structure is formed substantially by a structure with open pores. The disclosure also relates to a method for manufacturing such an implant.
    Type: Application
    Filed: November 7, 2006
    Publication date: March 19, 2009
    Applicant: FT INNOVATIONS (FTI) B.V.
    Inventors: Hermanus Hendricus Weinans, Johannes Albertus Nicolaas Verhaar, Peter Leerkamp, Bob Meuzelaar
  • Patent number: 7131288
    Abstract: In a heat exchanger (10) for transferring heat from a first fluid to a second fluid, which heat exchanger (10) comprises one or more flow passages (12) for a first fluid, the outer wall (26) of these passages is in heat-transferring contact with a flow body (20) made from metal foam for a second fluid. This metal foam has a gradient of the volume density of the metal, so that it is possible to achieve a favorable equilibrium between heat transfer and conduction, on the one hand, and flow resistance, on the other hand.
    Type: Grant
    Filed: November 23, 2001
    Date of Patent: November 7, 2006
    Assignee: INCO Limited
    Inventors: Theodor Johannes Peter Toonen, Peter Leerkamp, Bob Meuzelaar
  • Patent number: 7089646
    Abstract: Methods for the production of a board (11) with printed circuit (12) shielded against interfering radiation and having electronic components (14) comprise the steps of positioning of the electronic components (14) on contact points (15) designed for them, and the application of a shield (20), comprising a preformed metallized plastic film (30) over the top of the electronic components (14) and in electrical contact with the earth (13) on the board (11) with printed circuit (12), and also fixing the electronic components (14) on the board (11) with printed circuit (12) by means of an electrically conducting fixing agent (16); and fixing of the shield (20) on the board (11) with printed circuit (12).
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: August 15, 2006
    Assignee: Stork Prints B.V.
    Inventors: Peter Leerkamp, Stephanus Gerardus Blankenborg
  • Patent number: 7078092
    Abstract: A gasket which shields against interfering radiation and comprises a metallized plastic foam has a network of open cells which are in communication with one another and is used, for example, to seal any gap between an earth wire on a PCB and cover which shields against interfering radiation. According to one aspect, the cells (34) are oriented in the height direction of the gasket in such a manner that the elastic compressibility of the gasket is at least 80% in the height direction.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: July 18, 2006
    Assignee: Stork Prints B.V.
    Inventor: Peter Leerkamp
  • Publication number: 20040247851
    Abstract: A gasket which shields against interfering radiation and comprises a metallized plastic foam has a network of open cells which are in communication with one another and is used, for example, to seal any gap between an earth wire on a PCB and cover which shields against interfering radiation. According to one aspect, the cells (34) are oriented in the height direction of the gasket in such a manner that the elastic compressibility of the gasket is at least 80% in the height direction.
    Type: Application
    Filed: March 29, 2004
    Publication date: December 9, 2004
    Inventor: Peter Leerkamp
  • Publication number: 20040226702
    Abstract: In a heat exchanger (10) for transferring heat from a first fluid to a second fluid, which heat exchanger (10) comprises one or more flow passages (12) for a first fluid, the outer wall (26) of these passages is in heat-transferring contact with a flow body (20) made from metal foam for a second fluid. This metal foam has a gradient of the volume density of the metal, so that it is possible to achieve a favorable equilibrium between heat transfer and conduction, on the one hand, and flow resistance, on the other hand.
    Type: Application
    Filed: December 29, 2003
    Publication date: November 18, 2004
    Inventors: Theodor Johannes Peter Toonen, Peter Leerkamp, Bob Meuzelaar
  • Publication number: 20040022046
    Abstract: Methods for the production of a board (11) with printed circuit (12) shielded against interfering radiation and having electronic components (14) comprise the steps of positioning of the electronic components (14) on contact points (15) designed for them, and the application of a shield (20), comprising a preformed metallized plastic film (30) over the top of the electronic components (14) and in electrical contact with the earth (13) on the board (11) with printed circuit (12), and also fixing the electronic components (14) on the board (11) with printed circuit (12) by means of an electrically conducting fixing agent (16); and fixing of the shield (20) on the board (11) with printed circuit (12).
    Type: Application
    Filed: July 10, 2003
    Publication date: February 5, 2004
    Inventors: Peter Leerkamp, Stephanus Gerardus Blankenborg
  • Publication number: 20030019344
    Abstract: A metal perforating stencil for use in making perforations in a film under vacuum comprises a metal support in which there are continuous openings which are separated by dykes. In this stencil, the ratio of the thickness of the stencil with respect to the maximum radius of an opening on the active side of the stencil is greater than 1.15. If desired, at least the active side of the stencil may be provided with a rough surface structure which is deposited by electrodeposition means. A stencil of this type has improved release properties, resulting in a long service life, which also has a beneficial effect on the production rate and the quality of the perforated film which is obtained using the stencil.
    Type: Application
    Filed: May 22, 2002
    Publication date: January 30, 2003
    Inventors: Peter Leerkamp, Cornelis Johannes Jeckmans
  • Publication number: 20010006151
    Abstract: Method for producing a nickel foam having a specific weight of between 200 and 400 g/m2, at least comprising the steps of:
    Type: Application
    Filed: December 27, 2000
    Publication date: July 5, 2001
    Inventors: Peter Leerkamp, Wilhelmus Aloysius Pruyn