Patents by Inventor Peter Lehfeld

Peter Lehfeld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Annular saw and method of protecting the clamping edge and of cleaning the saw blade of an annular saw
    Patent number: 6360737
    Abstract: There is an annular or internal-diameter saw and a method of protecting the clamping edge and of cleaning the saw blade of this annular or internal-diameter saw. The annular or internal-diameter saw has an element which partly screens the clamping edge and is arranged in the vicinity of the clamping edge and the saw blade, and has an outer material layer on the clamping edge. The outer material layer faces the element and is substantially harder than a clamping edge material lying behind it. The method is distinguished by the fact that workpiece residues thrown against the clamping edge are shattered when striking the clamping edge. This is due to the fact that an element partly screening the clamping edge is provided in the vicinity of the clamping edge and the saw blade.
    Type: Grant
    Filed: February 8, 2000
    Date of Patent: March 26, 2002
    Assignee: Wacker Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Wolf-Rüdiger Kurtze, Leopold Neussl, Peter Lehfeld
  • Method for achieving a wear performance which is as linear as possible and tool having a wear performance which is as linear as possible
    Patent number: 6129609
    Abstract: Material removing machining is for wafer shaped workpieces, in particular semiconductor wafers. There is a method for achieving a wear performance which is as linear as possible for a tool which has an essentially planar working surface for the material removing machining of wafer shaped workpieces. The tool has a wear performance which is as linear as possible. There are also a method and a device for measuring a wear profile on an essentially planar working surface for the material removing machining of wafer shaped workpieces. There is also a carrier which is used for the two-sided material removing machining of wafer shaped workpieces.
    Type: Grant
    Filed: November 3, 1998
    Date of Patent: October 10, 2000
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Bert Ripper, Robert Hofmann, Peter Lehfeld, Holger Lundt
  • Method and device for resharpening saws especially used for making semiconductor wafers
    Patent number: 5144938
    Abstract: A device and method for resharpening the cutting edge of saws used in particular in the centerhole sawing of semiconductor bars. It contains a sharpening system which consists of at least one elongate sharpening stone facing the cutting edge with its end face, is movable laterally relative to the saw blade and has at the end face two working surfaces which are located opposite one another and, during sharpening, can be brought into contact laterally with the cutting-edge surface facing them. The device affords trouble-free operation and permits sharpening actions during the sawing operations.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: September 8, 1992
    Assignee: Elektronik-Grundstoffe mbH
    Inventors: Helmut Seeburger, Peter Lehfeld, Wolf-Rudiger Kurtze