Patents by Inventor Peter Lieber

Peter Lieber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modules storing power configuration parameters
    Patent number: 10191525
    Abstract: A method and a device are provided. In an example, the method includes detecting a presence of a module in a socket. Based on detecting the presence of the module, a power configuration parameter stored in a memory of the module is read, and power is applied to an integrated circuit of the module according to the power configuration parameter.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: January 29, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Kevin B. Leigh, Peter Lieber
  • Air inlet channel with thermoelectric cooling element
    Patent number: 10039213
    Abstract: An example electronic device may include a chassis, a circuit board in the chassis that includes a first active component, a number of fans, a number of guide walls that define an air inlet channel, and a thermoelectric cooler (TEC). There may be an airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, with the first active component being located in the airflow path downstream of the intake opening of the air inlet channel. A cold portion of the TEC may extend into the airflow path upstream of the first active component and a hot portion of the TEC may extend into the airflow path downstream of the first active component.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: July 31, 2018
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: John Norton, Kevin Leigh, Peter Lieber
  • AIR INLET CHANNEL WITH THERMOELECTRIC COOLING ELEMENT
    Publication number: 20180206365
    Abstract: An example electronic device may include a chassis, a circuit board in the chassis that includes a first active component, a number of fans, a number of guide walls that define an air inlet channel, and a thermoelectric cooler (TEC). There may be an airflow path such that, when the fans operate, air flows along the airflow path from an intake opening of the air inlet channel to an exhaust of the chassis, with the first active component being located in the airflow path downstream of the intake opening of the air inlet channel. A cold portion of the TEC may extend into the airflow path upstream of the first active component and a hot portion of the TEC may extend into the airflow path downstream of the first active component.
    Type: Application
    Filed: January 13, 2017
    Publication date: July 19, 2018
    Inventors: John Norton, Kevin Leigh, Peter Lieber
  • MODULES STORING POWER CONFIGURATION PARAMETERS
    Publication number: 20180032117
    Abstract: A method and a device are provided. In an example, the method includes detecting a presence of a module in a socket. Based on detecting the presence of the module, a power configuration parameter stored in a memory of the module is read, and power is applied to an integrated circuit of the module according to the power configuration parameter.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 1, 2018
    Inventors: Kevin B. Leigh, Peter Lieber