Abstract: An improved system for testing electrical circuit boards in an environmental test chamber includes a carrier moveable into and out of the chamber. The carrier supports a relatively large number of printed circuit boards to be tested by exposure to extremes of temperature, for example. Each board is electrically linked to a carrier-mounted multiple-conductor "gang" connector. The chamber has a multiple-conductor gang receptacle into which the connector is plugged as the carrier moves fully into the chamber. Such arrangement provides a way to electrically monitor board testing by instruments outside the chamber. An automated insertion/extraction assembly powers the carrier between an interconnect position and a disconnect position. The circuit boards are handled as a group of "unit" and the assembly provides both automatic connection and disconnection upon initiation by the chamber operator. Circuit board testing may thereby be accomplished accurately and more expeditiously than with earlier systems.

Abstract: A product carrier and an environmental test chamber are constructed so that the carrier is positioned by sliding it into the chamber. The leading wall of the carrier includes an extended port for electrical connections and which projects in the direction of sliding movement of the carrier. The extended port mates with a junction to an external test control circuit, the junction being carried on a chamber wall in the path of movement of the carrier, but spaced from the test chamber itself. The external junction, being on that wall, is not exposed to the test environment within the chamber.

Abstract: A carrier for use in testing circuit boards includes a carrier frame adapted to be mounted vertically within a test chamber and a plurality of circuit board mounting modules for supporting at least one circuit board. The circuit board carrier frame has a plurality of vertically oriented module supports provided thereon and each of the circuit board mounting modules is constructed and arranged to be releasably mounted in one of the module supports. A first electrical connector assembly is mounted on the carrier frame for being connected to a source of electrical energy and test signals and a plurality of second electrical connector assemblies are each connected in circuit with the first electrical connector assembly and are located respectively adjacent the module supports and a third electrical connector assembly is mounted on each of the modules and each is adapted to be connected to one of the second electrical connector assemblies.