Abstract: The integrity of a liner in an interconnect structure or other layer in an integrate circuit is tested in a short time by exposing the liner to a reactive gas that attacks the underlying silicon or other material behind the liner. A weak spot in the liner permits the gas to react with the silicon, which produces a visible area that can be readily identified. The test can be performed in a few hours, in contrast to a period of several months required to complete the process, package the circuit and conduct a burn-in test.

Abstract: The integrity of a liner in an interconnect structure or other layer in an integrate circuit is tested in a short time by exposing the liner to a reactive gas that attacks the underlying silicon or other material behind the liner. A weak spot in the liner permits the gas to react with the silicon, which produces a visible area that can be readily identified. The test can be performed in a few hours, in contrast to a period of several months required to complete the process, package the circuit and conduct a burn-in test.

Abstract: An improved method of stabilizing wet chemical baths is disclosed. Typically such baths are used in processes for treating workpieces, for example, plating processes for plating metal onto substrates. In particular, the present invention relates to copper plating baths. More particularly, the present invention relates to the stability of copper plating baths. More particularly, the present invention relates to prevention of void formation by monitoring the accumulation of deleterious by-products in copper plating baths.

Abstract: Methods and apparatus are provided for forming films of materials which are component layers of solar energy conversion devices, e.g. photovoltaic cells and heat collector panels. A selected substrate, generally glass, is heated while being sprayed with solutions which react on the heated surface to form a particular film. Films of SnO.sub.x and CdS are particularly produced. According to the present invention, a thermal energy input gradient is provided to approximate the energy loss gradient during the spray process. Radiative heaters provide a rapid resupply of energy to the substrate and, in some instances, directly to the film forming surface. Temperature detectors, such as thermocouples, monitor substrate temperature to provide the radiative energy input needed for substantial temperature uniformity.

Abstract: A solar panel module is provided, wherein a plurality of solar panel units are electrically interconnected and supported within a low cost frame assembly, which may conveniently be formed from wood products. Each solar panel unit is provided with extending conductors for electrical connections with adjacent solar panels. Each solar panel unit is formed in a back-wall configuration where solar radiation is incident on a transparent vitreous substrate. The panel surface opposite the substrate is sealed, preferably with a bituminous material, to minimize permeation of the solar panel by environmental elements. The sealing material cooperates with the frame to provide an insulated exposed surface. In one embodiment, the completed module is formed to external dimensions generally standard in the building industry for easy installation.

Abstract: Methods and apparatus are provided for forming films of materials which are component layers of solar energy conversion devices, e.g. photovoltaic cells and heat collector panels. A selected substrate, generally glass, is heated while being sprayed with solutions which react on the heated surface to form a particular film. Films of SnO.sub.x and CdS are particularly produced. According to the present invention, a thermal energy input gradient is provided to approximate the energy loss gradient during the spray process. Radiative heaters provide a rapid resupply of energy to the substrate and, in some instances, directly to the film forming surface. Temperature detectors, such as thermocouples, monitor substrate temperature to provide the radiative energy input needed for substantial temperature uniformity.