Abstract: High density fiber interfaces for silicon photonics based integrated-optics products are provided via a system or device that includes: a prism configured to reflect, via a lensed reflecting surface, a plurality of optical signals between a first surface and a second surface at a non-normal angle of incidence; a photonic interposer including a plurality of grating couplers corresponding to the plurality of optical signals that are arranged in a two-dimensional array and that are optically connected directly to the first surface of the prism; and a plurality of optical fibers that are arranged in the two-dimensional array and that are optically connected directly to the second surface of the prism.

Abstract: The invention pertains to an optical switch matrix comprising n input channels, branching means for dividing the input channels up into p branched channels, merging means for merging the p branched channels into m output channels, and optical fibers for connecting the output channels of the branching means with the input channels of the merging means, wherein n, m, and p are natural numbers greater than or equal to 2, and wherein the branching means, the fibers, and the merging means are each attached to a separate substrate or a separate group of substrates. The optical switching matrix according to the invention is very compact and allows efficient use of the materials available for the manufacture thereof.

Abstract: The invention relates to a method of fabricating an electro-optical device which comprises integrating a semiconductor component with a polymeric optical waveguide component. According to the invention, a semiconductor component obtained by epitaxial lift-off (ELO) is embedded in a waveguide device which in addition to a polymeric optical waveguide structure comprises an appropriate cavity. The invention further pertains to an integrated electro-optical device attainable by means of this ELO technique. Notably, it concerns an integrated electro-optical device in which the polymeric waveguide component and the semiconductor component are integrated on a substrate made of a different material from that of the semiconductor component, preferably a material with good heat dissipation, such as silicon. Preferably, the polymeric waveguide component comprises a polymer in which waveguide channels have been provided by bleaching.