Abstract: The invention relates to methods and structures for connecting circuits and circuit elements processing electrical signals having very fast transition times, including sub-nanosecond transition times. It includes a connecting structure for connecting a multiplicity of signal lines at a common point to reduce unwanted reflections thereat; a single or multi-conductor female connector for receiving thin elements such as ribbon cable ends, printed circuit (PC) board edges, and the like; a structure for connecting together a multiplicity of ribbon cables terminating in such multi-conductor female connectors, and a further structure for connecting together a multiplicity of such multi-cable connectors to obtain maximum packing thereof, and minimum conductor lengths thereto, to obtain processing rates up to twenty-fold over what is available with present connecting methods and structures.

Abstract: A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

Abstract: A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

Abstract: An adapter for coupling electrical signal to and from an integrated circuit device mounted on a circuit board has a frame composed of individual side sections with each side section having ribs formed therein for providing detented cantilever engagement of the side sections to the sides of the IC device. Electrically conductive elements fit in between the ribs and engage the leads on the IC. The electrically conductive elements are connected to conductive pads formed on a substrate that is secured with the frame. A securing means that includes pins are used for securing the side sections together.

Abstract: A high density connector in which the conductive leads of at least two circuit boards, two flexible circuits, or one of each are interconnected directly without the use of a traditional molded connector with pins captured therein. This is accomplished by overlapping the two boards with the conductive paths on each to be interconnected facing each other. An anisotropic elastomeric polymer material is inserted between the boards and then the sandwich is clamped together compressing the polymer material to provide a low electrical resistance path therethrough to interconnect the conductive paths on the respective circuit boards. One disclosed embodiment utilizes backing plates above and below the sandwich with a plurality of screws passing through registration holes to align the conductive paths and to provide closure of the connector. The other disclosed embodiment is designed to interconnect two boards along substantially the full width of the boards.

Abstract: A microstrip transmission line comprises a plurality of signal-carrying lines disposed along a dielectric ribbon and separated by a predetermined spacing. Ground-plane conductors are disposed on the opposite side of the ribbon in staggered relation to the signal-carrying lines such that the ground-plane conductors occupy spaces corresponding to the gaps between adjacent signal-carrying lines. This arrangement lowers the capacitance and raises the impedance of the transmission line while maintaining high signal line density.