Patents by Inventor Peter M. Dussinger
Peter M. Dussinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7748436Abstract: The apparatus is a capillary loop evaporator in which the vapor space is the internal volume of a cup shaped evaporator wick with sidewalls in full contact with the outer casing of the evaporator. Liquid is furnished to the wick through thicker wick wall sections, slabs protruding from the liquid-vapor barrier wick, eccentric wick cross sections, or tunnel arteries. The tunnel arteries can also be formed within heat flow reducing ridges protruding into the vapor space. The tunnel arteries can be fed liquid by bayonet tubes or cable arteries, and can be isolated from the heat source with regions of finer wick to impede vapor flow into the liquid. Tunnel arteries also enable separation of the evaporator and the reservoir for thermal isolation and structural flexibility. A wick within the reservoir aids collection of liquid in low gravity applications.Type: GrantFiled: May 3, 2006Date of Patent: July 6, 2010Assignee: Advanced Cooling Technologies, IncInventors: William G. Anderson, David Sarraf, Peter M. Dussinger, John R. Hartenstine
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Patent number: 7100679Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: GrantFiled: December 18, 2003Date of Patent: September 5, 2006Assignee: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers
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Patent number: 7100680Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: GrantFiled: August 9, 2005Date of Patent: September 5, 2006Assignee: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers
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Patent number: 7066240Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: GrantFiled: May 9, 2001Date of Patent: June 27, 2006Assignee: Thermal CorpInventors: Peter M. Dussinger, Thomas L. Myers
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Patent number: 7028760Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.Type: GrantFiled: March 1, 2005Date of Patent: April 18, 2006Assignee: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers, John H. Rosenfeld, Kenneth L. Minnerly
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Patent number: 6896039Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.Type: GrantFiled: May 7, 2004Date of Patent: May 24, 2005Assignee: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers, John H. Rosenfeld, Kenneth L. Minnerly
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Publication number: 20040244951Abstract: A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.Type: ApplicationFiled: May 7, 2004Publication date: December 9, 2004Inventors: Peter M. Dussinger, Thomas L. Myers, John H. Rosenfeld, Kenneth L. Minnerly
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Patent number: 6712128Abstract: An air flow apparatus including an elongate post and a plurality of fin disks disposed on the elongate post, each fin disk including a centrally disposed opening therein for receiving the elongate post, and a plurality of flow openings disposed around the periphery of the centrally disposed opening. The air flow apparatus is preferably used in conjunction with a circulation device to form a heat exchanger.Type: GrantFiled: November 20, 2002Date of Patent: March 30, 2004Assignee: Thermal Corp.Inventors: Peter M. Dussinger, David Sarraf
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Publication number: 20020050341Abstract: The invention is a flat heat pipe heat spreader with the addition of a solid heat conductive structure spanning the internal space in the heat pipe only at the region of contact with the heat source. Capillary wick is also bonded to the sides of the solid heat conductive structure. Thus, the solid structure provides both direct heat conduction from the heat source to a heat sink mounted atop the heat spreader and also acts as an extended evaporator surface within the heat pipe. The combination furnishes a decrease in the thermal resistance compared to a heat pipe without the solid structure.Type: ApplicationFiled: December 12, 2001Publication date: May 2, 2002Inventors: Peter M. Dussinger, Thomas L. Myers
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Publication number: 20020023742Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: ApplicationFiled: May 9, 2001Publication date: February 28, 2002Applicant: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers
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Patent number: 6302192Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.Type: GrantFiled: May 12, 1999Date of Patent: October 16, 2001Assignee: Thermal Corp.Inventors: Peter M. Dussinger, Thomas L. Myers
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Patent number: 5586549Abstract: The apparatus is a hybrid solar collector which permits heating by both solar energy and fossil fuels. The hollow solar collector structure acts as the vapor space for a heat pipe for which the heat utilization device acts as the condenser. A solar evaporator wick covers the inside surface of the solar collector, and one or more burners are located adjacent to the solar collector. Each burner has a burner evaporator wick mounted directly on the surface of the combustion chamber and the wick is either exposed within the vapor space of the solar heat pipe or made a part of an intermediate heat pipe which cools the combustion chamber surface and heats an auxiliary evaporator wick within the solar heat pipe. Thus, heat produced by either solar radiation or fuel combustion evaporates the working fluid in the solar heat pipe.Type: GrantFiled: January 3, 1996Date of Patent: December 24, 1996Assignee: Thermacore, Inc.Inventors: John R. Hartenstine, Peter M. Dussinger
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Patent number: 4854379Abstract: A vapor block resistant liquid artery structure for heat pipes. A solid tube artery with openings is encased in the sintered material of a heat pipe wick. The openings are limited to that side of the artery which is most remote from the heat source. The liquid in the artery can thus exit the artery through the openings and wet the sintered sheath, but vapor generated at the heat source is unlikely to move around the solid wall of the artery and reverse its direction in order to penetrate the artery through the openings. An alternate embodiment uses finer pore size wick material to resist vapor entry.Type: GrantFiled: February 15, 1989Date of Patent: August 8, 1989Assignee: Thermacore, Inc.Inventors: Robert M. Shaubach, Peter M. Dussinger, Matthew T. Buchko
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Patent number: 4815528Abstract: A vapor block resistant liquid artery structure for heat pipes. A solid tube artery with openings is encased in the sintered material of a heat pipe wick. The openings are limited to that side of the artery which is most remote from the heat source. The liquid in the artery can thus exit the artery through the openings and wet the sintered sheath, but vapor generated at the heat source is unlikely to move around the solid wall of the artery and reverse its direction in order to penetrate the artery through the openings. An alternate embodiment uses finer pore size wick material to resist vapor entry.Type: GrantFiled: September 25, 1987Date of Patent: March 28, 1989Assignee: Thermacore, Inc.Inventors: Robert M. Shaubach, Peter M. Dussinger, Matthew T. Buchko