Patents by Inventor Peter M. Elenius

Peter M. Elenius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance, low cost multi-chip modle package
    Patent number: 5838545
    Abstract: A high performance, low cost multi-chip module package using a heatsink as a substrate with thin film wiring techniques or multilayered wiring techniques for interconnection of the chips on the surface of the module and a solder column grid array or solder ball grid array for interconnection to the next level of packaging (printed circuit board). The columns or balls create a space between the board and module with the chips being in the space and provide the required interconnect density.
    Type: Grant
    Filed: October 17, 1996
    Date of Patent: November 17, 1998
    Assignee: International Business Machines Corporation
    Inventors: Dennis F. Clocher, Glenn G. Daves, Peter M. Elenius, Joseph J. Lisowski, Joseph M. Sullivan
  • Method and apparatus for cooling thermally massive parts in a continuous furnace
    Patent number: 5373893
    Abstract: A method and apparatus for cooling thermally massive parts includes directing a chilled gas onto an electrical component travelling on the belt of a continuous furnace. The belt is divided into a series of hot and cold zones to provide thermal stressing to the electrical component to detect early life failure. As the component cools, a constant thermal stress is maintained by either lowering the temperature or increasing the flow rate of the chilled gas.
    Type: Grant
    Filed: October 19, 1992
    Date of Patent: December 20, 1994
    Assignee: International Business Machines Corporation
    Inventors: David E. Eisenmann, Peter M. Elenius, James M. Leas, Wagih M. Wazni