Abstract: A method of imaging a feature of a semiconductor device is provided. The method includes the steps of: (a) imaging a first portion of a semiconductor device to form a first imaged portion; (b) imaging a subsequent portion of the semiconductor device to form a subsequent imaged portion; (c) adding the subsequent imaged portion to the first imaged portion to form a combined imaged portion; and (d) comparing the combined imaged portion to a reference image of a feature to determine a level of correlation of the combined imaged portion to the reference image.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: An apparatus and method is provided for capturing component location information through the use of fiber optic conduits. In various embodiments, an image of a component attached to a translatable and rotatable spindle is captured and transmitted along a fiber optic conduit to a camera coupled to an image processing computer. The image processing computer determines component location on the spindle based on the transmitted image and, where necessary, generates component location correction information so that the spindle and attached component can be moved to a determined location. A plurality of fiber optic conduits may be bundled together to provide a single combined image of multiple components attached to multiple spindles which can be captured by a single camera, wherein the image processing computer segregates the images and determines multiple component location correction information.

Abstract: A prismatic viewing plate is situated across the focal axis between an object and an imaging device such as a camera capable of acquiring only a two dimensional image of the object. A characteristic of the prismatic plate is that it presents dual images of the object to the imaging device. Characteristic of the separation between the dual images is that it is dependent upon the distance of the object from the prismatic plate. These characteristics are employed to determine a range to the object by measuring the separation between the dual images, visually or by use of one of the many available machine vision techniques. A third dimension of a surface profile also can be obtained by scanning a spot of light over the object while separately viewing the spot through the prismatic plate and measuring the separation between dual images of the light spot at various points of the scan.